Holger Worner

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method of producing a universal semiconductor housing with precross...
- Patent number 7,517,722
- Issue date Apr 14, 2009
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package having integrated cooling element with clearance...
- Patent number 7,064,429
- Issue date Jun 20, 2006
- Infineon Technologies AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with at least one semiconductor chip and metho...
- Patent number 6,953,992
- Issue date Oct 11, 2005
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal package for an electronic component with a semiconductor...
- Patent number 6,867,471
- Issue date Mar 15, 2005
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with at least two stacked semiconductor chips...
- Patent number 6,710,455
- Issue date Mar 23, 2004
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and process for producing the electronic compo...
- Patent number 6,683,374
- Issue date Jan 27, 2004
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of producing a universal semiconductor housing with precross...
- Publication number 20060258046
- Publication date Nov 16, 2006
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Universal package for an electronic component with a semiconductor...
- Publication number 20040041251
- Publication date Mar 4, 2004
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Universal semiconductor housing with precrosslinked plastic embeddi...
- Publication number 20040043515
- Publication date Mar 4, 2004
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component with at least one semiconductor chip and metho...
- Publication number 20030071336
- Publication date Apr 17, 2003
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component with at least two stacked semiconductor chips...
- Publication number 20030047813
- Publication date Mar 13, 2003
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component with at least two stacked semiconductor chips...
- Publication number 20030043555
- Publication date Mar 6, 2003
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component and process for producing the electronic compo...
- Publication number 20030042590
- Publication date Mar 6, 2003
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component with at least two stacked semiconductor chips,...
- Publication number 20030042591
- Publication date Mar 6, 2003
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component and method for producing the electronic component
- Publication number 20020195701
- Publication date Dec 26, 2002
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS

Holger Worner

Person

Patents Grantslast 30 patents

Method of producing a universal semiconductor housing with precross...

Electronic package having integrated cooling element with clearance...

Electronic component with at least one semiconductor chip and metho...

Universal package for an electronic component with a semiconductor...

Electronic component with at least two stacked semiconductor chips...

Electronic component and process for producing the electronic compo...

Patents Applicationslast 30 patents

Method of producing a universal semiconductor housing with precross...

Universal package for an electronic component with a semiconductor...

Universal semiconductor housing with precrosslinked plastic embeddi...

Electronic component with at least one semiconductor chip and metho...

Electronic component with at least two stacked semiconductor chips...

Electronic component with at least two stacked semiconductor chips...

Electronic component and process for producing the electronic compo...

Electronic component with at least two stacked semiconductor chips,...

Electronic component and method for producing the electronic component