Hollie Reed

Person

Pearland, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Sacrificial compositions and methods of fabricating a structure usi...
- Patent number 7,923,194
- Issue date Apr 12, 2011
- Georgia Tech Research Corporation
- Paul A. Kohl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sacrificial compositions and methods of fabricating a structure usi...
- Patent number 7,695,894
- Issue date Apr 13, 2010
- Georgia Tech Research Corporation
- Paul A. Kohl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sacrificial compositions and methods of fabricating a structure usi...
- Patent number 7,459,267
- Issue date Dec 2, 2008
- Georgia Tech Research Corporation
- Paul A. Kohl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sacrificial compositions, methods of use thereof, and methods of de...
- Patent number 7,052,821
- Issue date May 30, 2006
- Georgia Tech Research Corporation
- Paul A. Kohl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Guided-wave optical interconnections embedded within a microelectro...
- Patent number 6,954,576
- Issue date Oct 11, 2005
- Georgia Tech Research Corporation
- Tony Mule′
- G02 - OPTICS
Information Patent Grant
Fabrication of semiconductor devices with air gaps for ultra low ca...
- Patent number 6,888,249
- Issue date May 3, 2005
- Georgia Tech Research Corporation
- Paul Albert Kohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane, printed wiring board, and/or multi-chip module-level opt...
- Patent number 6,788,867
- Issue date Sep 7, 2004
- Georgia Tech Research Corp.
- Tony Mule′
- G02 - OPTICS
Information Patent Grant
Guided-wave optical interconnections embedded within a microelectro...
- Patent number 6,785,458
- Issue date Aug 31, 2004
- Georgia Tech Research Corporation
- Tony Mule′
- G02 - OPTICS
Information Patent Grant
Compliant wafer-level packaging devices and methods of fabrication
- Patent number 6,690,081
- Issue date Feb 10, 2004
- Georgia Tech Research Corporation
- Muhannad S. Bakir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of semiconductor device with air gaps for ultra low cap...
- Patent number 6,610,593
- Issue date Aug 26, 2003
- Georgia Tech Research Corporation
- Paul Albert Kohl
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Sacrificial Compositions And Methods Of Fabricating A Structure Usi...
- Publication number 20090120905
- Publication date May 14, 2009
- Georgia Tech Research Corporation
- Paul A. Kohl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Sacrificial Compositions And Methods Of Fabricating A Structure Usi...
- Publication number 20090107952
- Publication date Apr 30, 2009
- Georgia Tech Research Corporation
- Paul A. Kohl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Sacrificial compositions and methods of fabricating a structure usi...
- Publication number 20060263718
- Publication date Nov 23, 2006
- Paul A. Kohl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Guided-wave optical interconnections embedded within a microelectro...
- Publication number 20040264840
- Publication date Dec 30, 2004
- Tony Mule'
- G02 - OPTICS
Information Patent Application
Sacrificial compositions, methods of use thereof, and methods of de...
- Publication number 20040146803
- Publication date Jul 29, 2004
- Paul A. Kohl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Backplane, printed wiring board, and/or multi-chip module-level opt...
- Publication number 20040126076
- Publication date Jul 1, 2004
- Tony Mule'
- G02 - OPTICS
Information Patent Application
Fabrication of semiconductor devices with air gaps for ultra low ca...
- Publication number 20040038513
- Publication date Feb 26, 2004
- Paul Albert Kohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backplane, printed wiring board, and/or multi-chip module-level opt...
- Publication number 20030012539
- Publication date Jan 16, 2003
- Tony Mule'
- G02 - OPTICS
Information Patent Application
Guided-wave optical interconnections embedded within a microelectro...
- Publication number 20020136481
- Publication date Sep 26, 2002
- Tony Mule'
- G02 - OPTICS
Information Patent Application
Compliant wafer-level packaging devices and methods of fabrication
- Publication number 20020127768
- Publication date Sep 12, 2002
- Muhannad S. Badir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication of semiconductor devices with air gaps for ultra low ca...
- Publication number 20020081787
- Publication date Jun 27, 2002
- Paul Albert Kohl
- H01 - BASIC ELECTRIC ELEMENTS

Hollie Reed

Person

Patents Grantslast 30 patents

Sacrificial compositions and methods of fabricating a structure usi...

Sacrificial compositions and methods of fabricating a structure usi...

Sacrificial compositions and methods of fabricating a structure usi...

Sacrificial compositions, methods of use thereof, and methods of de...

Guided-wave optical interconnections embedded within a microelectro...

Fabrication of semiconductor devices with air gaps for ultra low ca...

Backplane, printed wiring board, and/or multi-chip module-level opt...

Guided-wave optical interconnections embedded within a microelectro...

Compliant wafer-level packaging devices and methods of fabrication

Fabrication of semiconductor device with air gaps for ultra low cap...

Patents Applicationslast 30 patents

Sacrificial Compositions And Methods Of Fabricating A Structure Usi...

Sacrificial Compositions And Methods Of Fabricating A Structure Usi...

Sacrificial compositions and methods of fabricating a structure usi...

Guided-wave optical interconnections embedded within a microelectro...

Sacrificial compositions, methods of use thereof, and methods of de...

Backplane, printed wiring board, and/or multi-chip module-level opt...

Fabrication of semiconductor devices with air gaps for ultra low ca...

Backplane, printed wiring board, and/or multi-chip module-level opt...

Guided-wave optical interconnections embedded within a microelectro...

Compliant wafer-level packaging devices and methods of fabrication

Fabrication of semiconductor devices with air gaps for ultra low ca...