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Homyar C. Mogul
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San Diego, CA, US
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Patents Grants
last 30 patents
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Patent Grant
Interconnect sensor for detecting delamination
Patent number
8,618,539
Issue date
Dec 31, 2013
QUALCOMM Incorporated
Brian Matthew Henderson
G01 - MEASURING TESTING
Patents Applications
last 30 patents
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Patent Application
CIRCUIT AND METHOD FOR TESTING INSULATING MATERIAL
Publication number
20120212245
Publication date
Aug 23, 2012
QUALCOMM Incorporated
Angelo Pinto
G01 - MEASURING TESTING
Information
Patent Application
Interconnect Sensor for Detecting Delamination
Publication number
20110101347
Publication date
May 5, 2011
QUALCOMM Incorporated
Brian Matthew Henderson
G01 - MEASURING TESTING