Hon Chiu Hui

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Kwai Chung, HK

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Patents Grantslast 30 patents

Information Patent Grant
Die bonder providing a large bonding force
- Patent number 8,651,159
- Issue date Feb 18, 2014
- ASM Assembly Automation LTD
- Sun Kuen Wong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Dispensation of controlled quantities of material onto a substrate
- Patent number 6,991,825
- Issue date Jan 31, 2006
- ASM Assembly Automation Ltd.
- Hon Chiu Hui
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...

Patents Applicationslast 30 patents

Information Patent Application
ROTARY BONDING TOOL WHICH PROVIDES A LARGE BOND FORCE
- Publication number 20110048648
- Publication date Mar 3, 2011
- Yin Fun NG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDER PROVIDING A LARGE BONDING FORCE
- Publication number 20100314050
- Publication date Dec 16, 2010
- Sun Kuen WONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dispensation of controlled quantities of material onto a substrate
- Publication number 20030209560
- Publication date Nov 13, 2003
- ASM Assembly Automation Ltd
- Hon Chiu Hui
- H01 - BASIC ELECTRIC ELEMENTS