Hon Shing Law

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Kwai Chung, HK

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Patents Grantslast 30 patents

Information Patent Grant
Wire-bonding apparatus with improved XY-table orientation
- Patent number 6,808,102
- Issue date Oct 26, 2004
- ASM Assembly Automation Ltd.
- Wing Cheung Ho
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR