Hong-Bin Shi

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Shanghai, CN

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Patents Applicationslast 30 patents

Information Patent Application
Integrated circuit package component with ball conducting joints
- Publication number 20110235296
- Publication date Sep 29, 2011
- Quanta Computer Inc.
- Hong-Bin Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package component with lateral conductive pins
- Publication number 20110235297
- Publication date Sep 29, 2011
- Quanta Computer Inc.
- Hong-Bin Shi
- H01 - BASIC ELECTRIC ELEMENTS