Hong-Da Chang

Person

Tai-Chung Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Carrying substrate, electronic package having the carrying substrat...
- Patent number 12,125,828
- Issue date Oct 22, 2024
- Siliconware Precision Industries Co., Ltd.
- Chi-Ching Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrying substrate, electronic package having the carrying substrat...
- Patent number 11,923,337
- Issue date Mar 5, 2024
- Siliconware Precision Industries Co., Ltd.
- Chi-Ching Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with multiple electronic components spaced apart...
- Patent number 11,676,877
- Issue date Jun 13, 2023
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package, packaging substrate, and methods for fabricatin...
- Patent number 11,600,571
- Issue date Mar 7, 2023
- Siliconware Precision Industries Co., Ltd.
- Jun-Chang Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with multiple electronic components spaced apart...
- Patent number 11,398,413
- Issue date Jul 26, 2022
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package, packaging substrate, and methods for fabricatin...
- Patent number 10,903,167
- Issue date Jan 26, 2021
- Siliconware Precision Industries Co., Ltd.
- Jun-Chang Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having conductive pillars
- Patent number 9,659,806
- Issue date May 23, 2017
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and fabrication method thereof
- Patent number 9,607,974
- Issue date Mar 28, 2017
- Siliconware Precision Industries Co., Ltd.
- Chun-Tang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 9,520,304
- Issue date Dec 13, 2016
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for fabricating the same
- Patent number 9,502,335
- Issue date Nov 22, 2016
- Siliconware Precision Industries Co., Ltd.
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of wafer level package having a pressure sensor
- Patent number 9,487,393
- Issue date Nov 8, 2016
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package structure and fabrication method thereof
- Patent number 9,425,119
- Issue date Aug 23, 2016
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level package having a pressure sensor and fabrication method...
- Patent number 9,133,021
- Issue date Sep 15, 2015
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package structure having micro-electro-mechanical system element an...
- Patent number 8,878,356
- Issue date Nov 4, 2014
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating package structure having MEMS elements
- Patent number 8,633,048
- Issue date Jan 21, 2014
- Siliconware Precision Industries Co., Ltd.
- Chen-Han Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 8,525,324
- Issue date Sep 3, 2013
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for continuously detecting glucose concentration in sample,...
- Patent number 8,415,170
- Issue date Apr 9, 2013
- Industrial Technology Research Institute
- Kun-Feng Lee
- G01 - MEASURING TESTING
Information Patent Grant
Package structure having MEMS elements and fabrication method thereof
- Patent number 8,399,940
- Issue date Mar 19, 2013
- Siliconware Precision Industries Co., Ltd.
- Chen-Han Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of making white LED package structure having a silicon subst...
- Patent number 8,172,632
- Issue date May 8, 2012
- Touch Micro-System Technology Corp.
- Hung-Yi Lin
- F21 - LIGHTING
Information Patent Grant
Light emitting diode structure
- Patent number 7,821,094
- Issue date Oct 26, 2010
- Touch Micro-System Technology Inc.
- Hung-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
White LED package structure having a silicon substrate and method o...
- Patent number 7,741,772
- Issue date Jun 22, 2010
- Touch Micro-System Technology Inc.
- Hung-Yi Lin
- F21 - LIGHTING
Information Patent Grant
Light emitting diode structure and manufacturing method thereof
- Patent number 7,510,892
- Issue date Mar 31, 2009
- Touch Micro-System Technology Inc.
- Hung-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leakage detection apparatus and method for multi-channel inkjet car...
- Patent number 7,182,423
- Issue date Feb 27, 2007
- Industrial Technology Research Institute
- Shyh-Haur Su
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Device for supporting a circular saw of sawing machine
- Patent number 4,532,844
- Issue date Aug 6, 1985
- Jen W. Chang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CARRYING SUBSTRATE, ELECTRONIC PACKAGE HAVING THE CARRYING SUBSTRAT...
- Publication number 20250015054
- Publication date Jan 9, 2025
- Siliconware Precision Industries Co., Ltd.
- Chi-Ching Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRYING SUBSTRATE, ELECTRONIC PACKAGE HAVING THE CARRYING SUBSTRAT...
- Publication number 20230420420
- Publication date Dec 28, 2023
- Siliconware Precision Industries Co., Ltd.
- Chi-Ching Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic package with multiple electronic components spaced apart...
- Publication number 20220278013
- Publication date Sep 1, 2022
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE, PACKAGING SUBSTRATE, AND METHODS FOR FABRICATIN...
- Publication number 20210104465
- Publication date Apr 8, 2021
- Siliconware Precision Industries Co., Ltd.
- Jun-Chang Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRYING SUBSTRATE, ELECTRONIC PACKAGE HAVING THE CARRYING SUBSTRAT...
- Publication number 20200350285
- Publication date Nov 5, 2020
- Siliconware Precision Industries Co., Ltd.
- Chi-Ching Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE, PACKAGING SUBSTRATE, AND METHODS FOR FABRICATIN...
- Publication number 20200203277
- Publication date Jun 25, 2020
- Siliconware Precision Industries Co., Ltd.
- Jun-Chang Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STACKED STRUCTURE, METHOD FOR FABRICATING THE SAME, AND PAC...
- Publication number 20200043908
- Publication date Feb 6, 2020
- Siliconware Precision Industries Co., Ltd.
- Chee-Key Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE HAVING A SHIELDING LAYER
- Publication number 20190214372
- Publication date Jul 11, 2019
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20180068983
- Publication date Mar 8, 2018
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20160141227
- Publication date May 19, 2016
- Siliconware Precision Industries Co., Ltd.
- Chun-Tang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20160071784
- Publication date Mar 10, 2016
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF WAFER LEVEL PACKAGE HAVING A PRESSURE SENSOR
- Publication number 20150344299
- Publication date Dec 3, 2015
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20150325556
- Publication date Nov 12, 2015
- Siliconware Precision Industries Co., Ltd.
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20150162264
- Publication date Jun 11, 2015
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20150041969
- Publication date Feb 12, 2015
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE HAVING MICRO-ELECTRO-MECHANICAL SYSTEM ELEMENT AN...
- Publication number 20130341739
- Publication date Dec 26, 2013
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE HAVING MEMS ELEMENT AND FABRICATION METHOD THEREOF
- Publication number 20130320463
- Publication date Dec 5, 2013
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20130075888
- Publication date Mar 28, 2013
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FABRICATING PACKAGE STRUCTURE HAVING MEMS ELEMENTS
- Publication number 20130017643
- Publication date Jan 17, 2013
- Siliconware Precision Industries Co., Ltd.
- Chen-Han LIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE HAVING MEMS ELEMENTS AND FABRICATION METHOD THEREOF
- Publication number 20120292722
- Publication date Nov 22, 2012
- Siliconware Precision Industries Co., Ltd.
- Chen-Han Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL PACKAGE HAVING A PRESSURE SENSOR AND FABRICATION METHOD...
- Publication number 20120001274
- Publication date Jan 5, 2012
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR CONTINUOUSLY DETECTING GLUCOSE CONCENTRATION IN SAMPLE,...
- Publication number 20100304399
- Publication date Dec 2, 2010
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Kun-Feng Lee
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF MAKING WHITE LED PACKAGE STRUCTURE HAVING A SILICON SUBST...
- Publication number 20100047942
- Publication date Feb 25, 2010
- Hung-Yi Lin
- F21 - LIGHTING
Information Patent Application
LIGHT EMITTING DIODE STRUCTURE
- Publication number 20090032832
- Publication date Feb 5, 2009
- Hung-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE PACKAGE STRUCTURE AND METHOD OF MAKING THE SAME
- Publication number 20080210963
- Publication date Sep 4, 2008
- Hung-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20080197370
- Publication date Aug 21, 2008
- Hung-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WHITE LED PACKAGE STRUCTURE HAVING A SILICON SUBSTRATE AND METHOD O...
- Publication number 20080191605
- Publication date Aug 14, 2008
- Hung-Yi Lin
- F21 - LIGHTING
Information Patent Application
LED ARRAY PACKAGE STRUCTURE HAVING SILICON SUBSTRATE AND METHOD OF...
- Publication number 20080194054
- Publication date Aug 14, 2008
- Hung-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING FLOW CHANNEL CAPABLE OF BALANCING AIR PRESSURE
- Publication number 20080096137
- Publication date Apr 24, 2008
- Hong-Da Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF SEGMENTING A WAFER
- Publication number 20060276006
- Publication date Dec 7, 2006
- Chen-Hsiung Yang
- H01 - BASIC ELECTRIC ELEMENTS

Hong-Da Chang

Person

Patents Grantslast 30 patents

Carrying substrate, electronic package having the carrying substrat...

Carrying substrate, electronic package having the carrying substrat...

Electronic package with multiple electronic components spaced apart...

Electronic package, packaging substrate, and methods for fabricatin...

Electronic package with multiple electronic components spaced apart...

Electronic package, packaging substrate, and methods for fabricatin...

Semiconductor package having conductive pillars

Package structure and fabrication method thereof

Semiconductor package and fabrication method thereof

Package structure and method for fabricating the same

Fabrication method of wafer level package having a pressure sensor

Package structure and fabrication method thereof

Wafer level package having a pressure sensor and fabrication method...

Package structure having micro-electro-mechanical system element an...

Method for fabricating package structure having MEMS elements

Semiconductor package and method of fabricating the same

Method for continuously detecting glucose concentration in sample,...

Package structure having MEMS elements and fabrication method thereof

Method of making white LED package structure having a silicon subst...

Light emitting diode structure

White LED package structure having a silicon substrate and method o...

Light emitting diode structure and manufacturing method thereof

Leakage detection apparatus and method for multi-channel inkjet car...

Device for supporting a circular saw of sawing machine

Patents Applicationslast 30 patents

CARRYING SUBSTRATE, ELECTRONIC PACKAGE HAVING THE CARRYING SUBSTRAT...

CARRYING SUBSTRATE, ELECTRONIC PACKAGE HAVING THE CARRYING SUBSTRAT...

Electronic package with multiple electronic components spaced apart...

ELECTRONIC PACKAGE, PACKAGING SUBSTRATE, AND METHODS FOR FABRICATIN...

CARRYING SUBSTRATE, ELECTRONIC PACKAGE HAVING THE CARRYING SUBSTRAT...

ELECTRONIC PACKAGE, PACKAGING SUBSTRATE, AND METHODS FOR FABRICATIN...

PACKAGE STACKED STRUCTURE, METHOD FOR FABRICATING THE SAME, AND PAC...

METHOD FOR FABRICATING ELECTRONIC PACKAGE HAVING A SHIELDING LAYER

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

FABRICATION METHOD OF WAFER LEVEL PACKAGE HAVING A PRESSURE SENSOR

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

PACKAGE STRUCTURE HAVING MICRO-ELECTRO-MECHANICAL SYSTEM ELEMENT AN...

PACKAGE STRUCTURE HAVING MEMS ELEMENT AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

METHOD FOR FABRICATING PACKAGE STRUCTURE HAVING MEMS ELEMENTS

PACKAGE STRUCTURE HAVING MEMS ELEMENTS AND FABRICATION METHOD THEREOF

WAFER LEVEL PACKAGE HAVING A PRESSURE SENSOR AND FABRICATION METHOD...

METHOD FOR CONTINUOUSLY DETECTING GLUCOSE CONCENTRATION IN SAMPLE,...

METHOD OF MAKING WHITE LED PACKAGE STRUCTURE HAVING A SILICON SUBST...

LIGHT EMITTING DIODE STRUCTURE

LIGHT EMITTING DIODE PACKAGE STRUCTURE AND METHOD OF MAKING THE SAME

LIGHT EMITTING DIODE STRUCTURE AND MANUFACTURING METHOD THEREOF

WHITE LED PACKAGE STRUCTURE HAVING A SILICON SUBSTRATE AND METHOD O...

LED ARRAY PACKAGE STRUCTURE HAVING SILICON SUBSTRATE AND METHOD OF...

METHOD FOR FABRICATING FLOW CHANNEL CAPABLE OF BALANCING AIR PRESSURE

METHOD OF SEGMENTING A WAFER