Hong Du

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Cupertino, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating a dual damascene interconnect structure
- Patent number 7,413,990
- Issue date Aug 19, 2008
- Applied Materials, Inc.
- Yan Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a dual damascene interconnect structure
- Patent number 7,115,517
- Issue date Oct 3, 2006
- Applied Materials, Inc.
- Yan Ye
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FABRICATING A DUAL DAMASCENE INTERCONNECT STRUCTURE
- Publication number 20060216926
- Publication date Sep 28, 2006
- Applied Materials, Inc.
- Yan Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating a dual damascene interconnect structure
- Publication number 20040198062
- Publication date Oct 7, 2004
- APPLIED MATERIALS, INC.
- Yan Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming bilayer resist patterns
- Publication number 20040018742
- Publication date Jan 29, 2004
- APPLIED MATERIALS, INC.
- Jim Zhongyi He
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY