Hong-Ji Lee

Person

Taoyuan Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Buried conductive structure in semiconductor substrate
- Patent number 12,272,621
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kan-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming contact metal
- Patent number 12,211,747
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive feature formation and structure
- Patent number 12,046,510
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yip Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and manufacturing method thereof
- Patent number 12,048,154
- Issue date Jul 23, 2024
- Macronix International Co., Ltd.
- Hong-Ji Lee
Information Patent Grant
Method of forming contact metal
- Patent number 11,791,208
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and method for making
- Patent number 11,482,495
- Issue date Oct 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure and formation thereof
- Patent number 11,444,028
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hong-Mao Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact with a silicide region
- Patent number 11,411,094
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Wen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming contact metal
- Patent number 11,232,985
- Issue date Jan 25, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor contact structure
- Patent number 11,195,791
- Issue date Dec 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Wen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive feature formation and structure
- Patent number 11,031,286
- Issue date Jun 8, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yip Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a contact with a silicide region
- Patent number 10,535,748
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Wen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure and formation thereof
- Patent number 10,510,664
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company Limited
- Hong-Mao Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure and the method of forming the same
- Patent number 10,504,834
- Issue date Dec 10, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Wen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional non-volatile memory and manufacturing method thereof
- Patent number 10,424,593
- Issue date Sep 24, 2019
- Macronix International Co., Ltd.
- I-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming contact metal
- Patent number 10,418,279
- Issue date Sep 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for gap filling improvement
- Patent number 10,283,359
- Issue date May 7, 2019
- Taiwan Semiconductor Manufacturing Company Limited
- Chi-Yuan Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Interconnect structure and fabricating method thereof
- Patent number 10,204,859
- Issue date Feb 12, 2019
- Macronix International Co., Ltd.
- Hong-Ji Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating junction formation of transistors with contact formation
- Patent number 10,157,995
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Ting Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and fabricating method thereof
- Patent number 9,922,876
- Issue date Mar 20, 2018
- Macronix International Co., Ltd.
- Hong-Ji Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic component
- Patent number 9,899,139
- Issue date Feb 20, 2018
- Lite-On Electronics (Guangzhou) Limited
- Tsai-Chung Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 9,881,809
- Issue date Jan 30, 2018
- Macronix International Co., Ltd.
- Xin-Guan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure and formation thereof
- Patent number 9,735,107
- Issue date Aug 15, 2017
- Taiwan Semiconductor Manufacturing Company Limited
- Hong-Mao Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming contact metal
- Patent number 9,711,402
- Issue date Jul 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for gap filling improvement
- Patent number 9,624,576
- Issue date Apr 18, 2017
- Taiwan Semiconductor Manufacturing Company Limited
- Chi-Yuan Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 9,627,247
- Issue date Apr 18, 2017
- Macronix International Co., Ltd.
- Fang-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,449,915
- Issue date Sep 20, 2016
- Macronix International Co., Ltd.
- Hong-Ji Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of controlling contact hole profile for metal fill-in
- Patent number 9,425,086
- Issue date Aug 23, 2016
- Macronix International Co., Ltd.
- Fang-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming copper sulfide film for reducing copper oxidizati...
- Patent number 9,337,036
- Issue date May 10, 2016
- Macronix International Co., Ltd.
- Zusing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cluster system for eliminating barrier overhang
- Patent number 9,305,840
- Issue date Apr 5, 2016
- Macronix International Co., Ltd.
- Hsu-Sheng Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20240405023
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuen-Shin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240379758
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yip LOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240379759
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yip LOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURE FORMATION AND STRUCTURE
- Publication number 20240332076
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yip LOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE SILICIDE FOR STACKED MULTI-GATE DEVICE
- Publication number 20240297228
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yip Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240164099
- Publication date May 16, 2024
- Macronix International Co., Ltd.
- Hong-Ji LEE
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230411496
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kan-Ju LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURIED CONDUCTIVE STRUCTURE IN SEMICONDUCTOR SUBSTRATE
- Publication number 20230411242
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kan-Ju LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING METAL SURROUNDING VIA CONTACT AND ME...
- Publication number 20230402366
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuen-Shin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME
- Publication number 20230402278
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yan-Ming Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230387316
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuen-Shin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING CONTACT METAL
- Publication number 20230386918
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20230380174
- Publication date Nov 23, 2023
- Macronix International Co., Ltd.
- Li-Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230230916
- Publication date Jul 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuen-Shin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220399361
- Publication date Dec 15, 2022
- Macronix International Co., Ltd.
- Hong-Ji Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND METHOD FOR MAKING
- Publication number 20220375863
- Publication date Nov 24, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact with a Silicide Region
- Publication number 20220367667
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Wen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Contact Metal
- Publication number 20220148920
- Publication date May 12, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Feature Formation and Structure
- Publication number 20210296168
- Publication date Sep 23, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yip LOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND METHOD FOR MAKING
- Publication number 20200176382
- Publication date Jun 4, 2020
- Taiwan Semiconductor Manufacturing Company Limited
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Contact with a Silicide Region
- Publication number 20200152763
- Publication date May 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Wen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE AND FORMATION THEREOF
- Publication number 20200118935
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing Company Limited
- Hong-Mao Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR CONTACT STRUCTURE
- Publication number 20200111739
- Publication date Apr 9, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Wen CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Contact Metal
- Publication number 20200013674
- Publication date Jan 9, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL METAL DIFFUSION BARRIER AND PLASMA TREATMENT FOR OXIDIZED...
- Publication number 20190273147
- Publication date Sep 5, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Wen CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE AND THE METHOD OF FORMING THE SAME
- Publication number 20190273042
- Publication date Sep 5, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Feature Formation and Structure
- Publication number 20190273023
- Publication date Sep 5, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yip LOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL NON-VOLATILE MEMORY AND MANUFACTURING METHOD THEREOF
- Publication number 20190214402
- Publication date Jul 11, 2019
- Macronix International Co., Ltd.
- I-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20180211921
- Publication date Jul 26, 2018
- Macronix International Co., Ltd.
- Hong-Ji Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE AND FORMATION THEREOF
- Publication number 20170345765
- Publication date Nov 30, 2017
- Taiwan Semiconductor Manufacturing Company Limited
- Hong-Mao Lee
- H01 - BASIC ELECTRIC ELEMENTS

Hong-Ji Lee

Person

Patents Grantslast 30 patents

Buried conductive structure in semiconductor substrate

Method of forming contact metal

Conductive feature formation and structure

Memory device and manufacturing method thereof

Method of forming contact metal

Semiconductor arrangement and method for making

Contact structure and formation thereof

Contact with a silicide region

Method of forming contact metal

Method for forming semiconductor contact structure

Conductive feature formation and structure

Method of forming a contact with a silicide region

Contact structure and formation thereof

Contact structure and the method of forming the same

Three-dimensional non-volatile memory and manufacturing method thereof

Method of forming contact metal

Systems and methods for gap filling improvement

Interconnect structure and fabricating method thereof

Integrating junction formation of transistors with contact formation

Interconnect structure and fabricating method thereof

Magnetic component

Semiconductor device and method of fabricating the same

Contact structure and formation thereof

Method of forming contact metal

Systems and methods for gap filling improvement

Semiconductor device and method of fabricating the same

Semiconductor device and method of manufacturing the same

Method of controlling contact hole profile for metal fill-in

Method of forming copper sulfide film for reducing copper oxidizati...

Cluster system for eliminating barrier overhang

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

CONDUCTIVE FEATURE FORMATION AND STRUCTURE

SELECTIVE SILICIDE FOR STACKED MULTI-GATE DEVICE

MEMORY DEVICE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME

BURIED CONDUCTIVE STRUCTURE IN SEMICONDUCTOR SUBSTRATE

SEMICONDUCTOR DEVICE INCLUDING METAL SURROUNDING VIA CONTACT AND ME...

SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF FORMING CONTACT METAL

MEMORY DEVICE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR ARRANGEMENT AND METHOD FOR MAKING

Contact with a Silicide Region

Method of Forming Contact Metal

Conductive Feature Formation and Structure

SEMICONDUCTOR ARRANGEMENT AND METHOD FOR MAKING

Method of Forming a Contact with a Silicide Region

CONTACT STRUCTURE AND FORMATION THEREOF

METHOD FOR FORMING SEMICONDUCTOR CONTACT STRUCTURE

Method of Forming Contact Metal

CONFORMAL METAL DIFFUSION BARRIER AND PLASMA TREATMENT FOR OXIDIZED...

CONTACT STRUCTURE AND THE METHOD OF FORMING THE SAME

Conductive Feature Formation and Structure

THREE-DIMENSIONAL NON-VOLATILE MEMORY AND MANUFACTURING METHOD THEREOF

INTERCONNECT STRUCTURE AND FABRICATING METHOD THEREOF

CONTACT STRUCTURE AND FORMATION THEREOF