Hong Lin

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Formation method of semiconductor structure
- Patent number 12,080,589
- Issue date Sep 3, 2024
- Shanghai IC R&D Center Co., Ltd.
- Weijun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and method for manufacturing deep trench and through-s...
- Patent number 11,393,868
- Issue date Jul 19, 2022
- Shanghai IC R&D Center Co., Ltd.
- Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for hybrid wafer-to-wafer bonding
- Patent number 10,796,913
- Issue date Oct 6, 2020
- Shanghai IC R&D Center Co., Ltd.
- Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for exposing polysilicon gates
- Patent number 9,941,138
- Issue date Apr 10, 2018
- Shanghai IC R&D Center Co., Ltd.
- Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing an electroplated copper film in copper interc...
- Patent number 9,640,434
- Issue date May 2, 2017
- Shanghai IC R&D Center Co., Ltd.
- Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FORMATION METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20220059402
- Publication date Feb 24, 2022
- Shanghai IC R&D Center Co., Ltd.
- Weijun WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND METHOD FOR MANUFACTURING DEEP TRENCH AND THROUGH-S...
- Publication number 20210036048
- Publication date Feb 4, 2021
- Shanghai IC R&D Center Co., Ltd.
- Hong LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR HYBRID WAFER-TO-WAFER BONDING
- Publication number 20190214257
- Publication date Jul 11, 2019
- Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR EXPOSING POLYSILICON GATES
- Publication number 20170084466
- Publication date Mar 23, 2017
- Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING AN ELECTROPLATED COPPER FILM IN COPPER INTERC...
- Publication number 20160247717
- Publication date Aug 25, 2016
- Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS