Hong-Seng Shue

Person

Zhubei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Organic interposer including a dual-layer inductor structure and me...
- Patent number 12,142,582
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Han Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structure with zigzag patterns and method forming same
- Patent number 12,087,648
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump integration with redistribution layer
- Patent number 12,057,423
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer including a copper edge seal ring structure and methods...
- Patent number 12,040,289
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hong-Seng Shue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure with conductive via structure and method for forming...
- Patent number 11,908,790
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for detecting defects in semiconductor device
- Patent number 11,854,913
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielding structures
- Patent number 11,855,022
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure and method for forming the same
- Patent number 11,848,270
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hong-Seng Shue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic interposer including a dual-layer inductor structure and me...
- Patent number 11,769,741
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Han Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielding structures
- Patent number 11,380,639
- Issue date Jul 5, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic interposer including a dual-layer inductor structure and me...
- Patent number 11,348,884
- Issue date May 31, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Han Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with crack preventing structure
- Patent number 11,342,291
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having probe pads and seal ring
- Patent number 11,088,037
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming same
- Patent number 11,075,173
- Issue date Jul 27, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsiang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming fuse pad and bond pad of integrated circuit
- Patent number 11,011,462
- Issue date May 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielding structures
- Patent number 10,861,810
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor isolation structure with air gaps in deep trenches
- Patent number 10,049,941
- Issue date Aug 14, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hong-Seng Shue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming a high-voltage super junction by trench and epi...
- Patent number 9,614,031
- Issue date Apr 4, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 9,558,986
- Issue date Jan 31, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming fuse pad and bond pad of integrated circuit
- Patent number 9,496,221
- Issue date Nov 15, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor isolation structure with air gaps in deep trenches
- Patent number 9,269,609
- Issue date Feb 23, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hong-Seng Shue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for MEMS structure release
- Patent number 9,096,428
- Issue date Aug 4, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tai-I Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
High-voltage super junction by trench and epitaxial doping
- Patent number 9,093,520
- Issue date Jul 28, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Super junction trench metal oxide semiconductor device and method o...
- Patent number 8,975,153
- Issue date Mar 10, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical inspection system and optical inspection method
- Patent number 8,953,155
- Issue date Feb 10, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-I Yang
- G01 - MEASURING TESTING
Information Patent Grant
Deep well process for MEMS pressure sensor
- Patent number 8,558,330
- Issue date Oct 15, 2013
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shao-Chi Yu
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20240379584
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsiang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC INTERPOSER INCLUDING A DUAL-LAYER INDUCTOR STRUCTURE AND ME...
- Publication number 20240379589
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Han CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Seal Ring Structure with Zigzag Patterns and Method Forming Same
- Publication number 20240363457
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP INTEGRATION WITH REDISTRIBUTION LAYER
- Publication number 20240363569
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER INCLUDING A COPPER EDGE SEAL RING STRUCTURE AND METHODS...
- Publication number 20240332220
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hong-Seng Shue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE
- Publication number 20240120277
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hong-Seng SHUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC INTERPOSER INCLUDING A DUAL-LAYER INDUCTOR STRUCTURE AND ME...
- Publication number 20230369255
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Han CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER INCLUDING A COPPER EDGE SEAL RING STRUCTURE AND METHODS...
- Publication number 20230065794
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Hong-Seng SHUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Seal Ring Structure with Zigzag Patterns and Method Forming Same
- Publication number 20230066360
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE WITH CONDUCTIVE VIA STRUCTURE
- Publication number 20220367347
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Li YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDING STRUCTURES
- Publication number 20220328440
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC INTERPOSER INCLUDING A DUAL-LAYER INDUCTOR STRUCTURE AND ME...
- Publication number 20220285295
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Han CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Integration with Redistribution Layer
- Publication number 20220246565
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE WITH CONDUCTIVE VIA STRUCTURE AND METHOD FOR FORMING...
- Publication number 20220216143
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Li YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC INTERPOSER INCLUDING A DUAL-LAYER INDUCTOR STRUCTURE AND ME...
- Publication number 20220157744
- Publication date May 19, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Han CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DETECTING DEFECTS IN SEMICONDUCTOR DEVICE
- Publication number 20210366794
- Publication date Nov 25, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- YANG-CHE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Same
- Publication number 20210351139
- Publication date Nov 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsiang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDING STRUCTURES
- Publication number 20210091029
- Publication date Mar 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH CRACK PREVENTING STRUCTURE
- Publication number 20200357760
- Publication date Nov 12, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- Yao-Chun CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shielding Structures
- Publication number 20200168574
- Publication date May 28, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20200135664
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsiang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20200075435
- Publication date Mar 5, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- YANG-CHE CHEN
- G01 - MEASURING TESTING
Information Patent Application
CHIP STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20200058589
- Publication date Feb 20, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hong-Seng SHUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING FUSE PAD AND BOND PAD OF INTEGRATED CIRCUIT
- Publication number 20170062334
- Publication date Mar 2, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Isolation Structure with Air Gaps in Deep Trenches
- Publication number 20160172250
- Publication date Jun 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hong-Seng Shue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-VOLTAGE SUPER JUNCTION BY TRENCH AND EPITAXIAL DOPING
- Publication number 20150325642
- Publication date Nov 12, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods And Apparatus For MEMS Structure Release
- Publication number 20150308743
- Publication date Oct 29, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tai-I Yang
- F26 - DRYING
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20150076660
- Publication date Mar 19, 2015
- Taiwan Semiconductor Manufacturing company Ltd.
- TAI-I YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-VOLTAGE SUPER JUNCTION BY TRENCH AND EPITAXIAL DOPING
- Publication number 20150061007
- Publication date Mar 5, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPER JUNCTION TRENCH METAL OXIDE SEMICONDUCTOR DEVICE AND METHOD O...
- Publication number 20140264559
- Publication date Sep 18, 2014
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS

Hong-Seng Shue

Person

Patents Grantslast 30 patents

Organic interposer including a dual-layer inductor structure and me...

Seal ring structure with zigzag patterns and method forming same

Bump integration with redistribution layer

Interposer including a copper edge seal ring structure and methods...

Chip structure with conductive via structure and method for forming...

Method for detecting defects in semiconductor device

Shielding structures

Chip structure and method for forming the same

Organic interposer including a dual-layer inductor structure and me...

Shielding structures

Organic interposer including a dual-layer inductor structure and me...

Semiconductor packages with crack preventing structure

Semiconductor device having probe pads and seal ring

Semiconductor device and method of forming same

Method for forming fuse pad and bond pad of integrated circuit

Shielding structures

Semiconductor isolation structure with air gaps in deep trenches

Methods for forming a high-voltage super junction by trench and epi...

Semiconductor structure and manufacturing method thereof

Method for forming fuse pad and bond pad of integrated circuit

Semiconductor isolation structure with air gaps in deep trenches

Methods and apparatus for MEMS structure release

High-voltage super junction by trench and epitaxial doping

Super junction trench metal oxide semiconductor device and method o...

Optical inspection system and optical inspection method

Deep well process for MEMS pressure sensor

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

ORGANIC INTERPOSER INCLUDING A DUAL-LAYER INDUCTOR STRUCTURE AND ME...

Seal Ring Structure with Zigzag Patterns and Method Forming Same

BUMP INTEGRATION WITH REDISTRIBUTION LAYER

INTERPOSER INCLUDING A COPPER EDGE SEAL RING STRUCTURE AND METHODS...

CHIP STRUCTURE

ORGANIC INTERPOSER INCLUDING A DUAL-LAYER INDUCTOR STRUCTURE AND ME...

INTERPOSER INCLUDING A COPPER EDGE SEAL RING STRUCTURE AND METHODS...

Seal Ring Structure with Zigzag Patterns and Method Forming Same

CHIP STRUCTURE WITH CONDUCTIVE VIA STRUCTURE

SHIELDING STRUCTURES

ORGANIC INTERPOSER INCLUDING A DUAL-LAYER INDUCTOR STRUCTURE AND ME...

Bump Integration with Redistribution Layer

CHIP STRUCTURE WITH CONDUCTIVE VIA STRUCTURE AND METHOD FOR FORMING...

ORGANIC INTERPOSER INCLUDING A DUAL-LAYER INDUCTOR STRUCTURE AND ME...

METHOD FOR DETECTING DEFECTS IN SEMICONDUCTOR DEVICE

Semiconductor Device and Method of Forming Same

SHIELDING STRUCTURES

SEMICONDUCTOR PACKAGES WITH CRACK PREVENTING STRUCTURE

Shielding Structures

SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

CHIP STRUCTURE AND METHOD FOR FORMING THE SAME

METHOD FOR FORMING FUSE PAD AND BOND PAD OF INTEGRATED CIRCUIT

Semiconductor Isolation Structure with Air Gaps in Deep Trenches

HIGH-VOLTAGE SUPER JUNCTION BY TRENCH AND EPITAXIAL DOPING

Methods And Apparatus For MEMS Structure Release

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

HIGH-VOLTAGE SUPER JUNCTION BY TRENCH AND EPITAXIAL DOPING

SUPER JUNCTION TRENCH METAL OXIDE SEMICONDUCTOR DEVICE AND METHOD O...