Hong Tsu Chang

Person

Hsinchu Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Quad flat no-lead package structure
- Patent number 11,515,239
- Issue date Nov 29, 2022
- Novatek Microelectronics Corp.
- Hong-Dyi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and die
- Patent number 11,244,891
- Issue date Feb 8, 2022
- Novatek Microelectronics Corp.
- Jhih-Siou Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal modulator
- Patent number 10,284,289
- Issue date May 7, 2019
- NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
- Hong-Yeh Chang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Signal modulator
- Patent number 10,097,389
- Issue date Oct 9, 2018
- NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
- Hong-Yeh Chang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Inductance-capacitance (LC) oscillator
- Patent number 8,717,112
- Issue date May 6, 2014
- Industrial Technology Research Institute
- Hong-Yeh Chang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Injection-locked frequency divider
- Patent number 8,493,105
- Issue date Jul 23, 2013
- Industrial Technology Research Institute
- Hong-Yeh Chang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Injection-locked frequency divider
- Patent number 8,390,343
- Issue date Mar 5, 2013
- Industrial Technology Research Institute
- Hong-Yeh Chang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for preparing a structure with high aspect ratio
- Patent number 7,344,995
- Issue date Mar 18, 2008
- ProMos Technologies, Inc.
- Hung Yueh Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Volatile memory devices and methods for forming same
- Patent number 7,241,659
- Issue date Jul 10, 2007
- ProMos Technologies, Inc.
- Chin-Long Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry clean method instead of traditional wet clean after metal etch
- Patent number 6,526,996
- Issue date Mar 4, 2003
- Promos Technologies, Inc.
- Hong-Long Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-cleaning method of a via etching process
- Patent number 6,500,766
- Issue date Dec 31, 2002
- ProMos Technologies Inc.
- Hungyueh Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming tungsten interconnect and vias without tungsten l...
- Patent number 6,410,417
- Issue date Jun 25, 2002
- ProMos Technologies, Inc.
- Nien-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Defects reduction for a metal etcher
- Patent number 6,399,509
- Issue date Jun 4, 2002
- Promos Technologies, Inc.
- Hung-Yueh Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming tungsten interconnect with tungsten oxidation to...
- Patent number 6,143,653
- Issue date Nov 7, 2000
- ProMOS Technologies, Inc.
- Nien-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Brushless DC motor speed controller
- Patent number 5,563,980
- Issue date Oct 8, 1996
- Industrial Technology Research Institute
- Tshaw-Chuang Chen
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Torque control method and device for brushless DC motors for use in...
- Patent number 5,519,294
- Issue date May 21, 1996
- Industrial Technology Research Institute
- Tshaw-Chuang Chen
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method and device for controlling the speed of the brushless DC mot...
- Patent number 5,473,725
- Issue date Dec 5, 1995
- Industrial Technology Research Institute
- Tshaw-Chuang Chen
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method and device for limiting electrical current supplied to the m...
- Patent number 5,341,077
- Issue date Aug 23, 1994
- Industrial Technology Research Institute
- Tshaw-Chuang Chen
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND DIE
- Publication number 20220028775
- Publication date Jan 27, 2022
- NOVATEK MICROELECTRONICS CORP.
- Jhih-Siou Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUAD FLAT NO-LEAD PACKAGE STRUCTURE
- Publication number 20220020673
- Publication date Jan 20, 2022
- NOVATEK MICROELECTRONICS CORP.
- Hong-Dyi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INJECTION-LOCKED FREQUENCY DIVIDER
- Publication number 20130093475
- Publication date Apr 18, 2013
- Industrial Technology Research Institute
- Hong-Yeh Chang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
STACKED CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20130049192
- Publication date Feb 28, 2013
- Hong-Dyi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTANCE-CAPACITANCE (LC) OSCILLATOR
- Publication number 20130009715
- Publication date Jan 10, 2013
- Industrial Technology Research Institute
- Hong-Yeh Chang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
INJECTION-LOCKED FREQUENCY DIVIDER
- Publication number 20120019289
- Publication date Jan 26, 2012
- Industrial Technology Research Institute
- Hong-Yeh Chang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Two-step process for manufacturing deep trench
- Publication number 20080124935
- Publication date May 29, 2008
- ProMOS Technologies Inc.
- Hong-Long Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing memory card structure
- Publication number 20070246544
- Publication date Oct 25, 2007
- Sheila Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Memory card structure and method for manufacturing the same
- Publication number 20070216037
- Publication date Sep 20, 2007
- Dennis Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD
- Publication number 20070131649
- Publication date Jun 14, 2007
- Hong-Long Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Jig structure for manufacturin a stacked memory card
- Publication number 20070029655
- Publication date Feb 8, 2007
- Hong Tsu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked memory card and method for manufacturing the same
- Publication number 20060289980
- Publication date Dec 28, 2006
- Hong Tsu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for preparing a structure with high aspect ratio
- Publication number 20060160366
- Publication date Jul 20, 2006
- ProMOS Technologies Inc.
- Hung Yueh Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Volatile memory devices and methods for forming same
- Publication number 20050067648
- Publication date Mar 31, 2005
- ProMos Technologies Inc.
- Chin-Long Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of reducing wafer etching defect
- Publication number 20040067654
- Publication date Apr 8, 2004
- ProMOS Technologies, Inc.
- Chun-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dry clean method instead of traditional wet clean after metal etch
- Publication number 20030104697
- Publication date Jun 5, 2003
- ProMOS Technologies, Inc.
- Hong-Long Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Post-cleaning method of a via etching process
- Publication number 20020096494
- Publication date Jul 25, 2002
- ProMos Technologies Inc.
- Hungyueh Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Post-cleaning method of a via etching process
- Publication number 20020081859
- Publication date Jun 27, 2002
- Hungyueh Lu
- H01 - BASIC ELECTRIC ELEMENTS

Hong Tsu Chang

Person

Patents Grantslast 30 patents

Quad flat no-lead package structure

Integrated circuit package and die

Signal modulator

Signal modulator

Inductance-capacitance (LC) oscillator

Injection-locked frequency divider

Injection-locked frequency divider

Method for preparing a structure with high aspect ratio

Volatile memory devices and methods for forming same

Dry clean method instead of traditional wet clean after metal etch

Post-cleaning method of a via etching process

Method of forming tungsten interconnect and vias without tungsten l...

Defects reduction for a metal etcher

Method of forming tungsten interconnect with tungsten oxidation to...

Brushless DC motor speed controller

Torque control method and device for brushless DC motors for use in...

Method and device for controlling the speed of the brushless DC mot...

Method and device for limiting electrical current supplied to the m...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGE AND DIE

QUAD FLAT NO-LEAD PACKAGE STRUCTURE

INJECTION-LOCKED FREQUENCY DIVIDER

STACKED CHIP PACKAGE AND FABRICATION METHOD THEREOF

INDUCTANCE-CAPACITANCE (LC) OSCILLATOR

INJECTION-LOCKED FREQUENCY DIVIDER

Two-step process for manufacturing deep trench

Method for manufacturing memory card structure

Memory card structure and method for manufacturing the same

ETCHING METHOD

Jig structure for manufacturin a stacked memory card

Stacked memory card and method for manufacturing the same

Method for preparing a structure with high aspect ratio

Volatile memory devices and methods for forming same

Method of reducing wafer etching defect

Dry clean method instead of traditional wet clean after metal etch

Post-cleaning method of a via etching process

Post-cleaning method of a via etching process