Hong-Wei Chan

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit structure and method for forming the same
- Patent number 12,094,930
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Guan-Yao Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of forming a semiconductor device with resisti...
- Patent number 12,074,107
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hong-Wei Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect level with high resistance layer and method of forming...
- Patent number 11,923,295
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hong-Wei Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 11,908,829
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yao-Te Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor chip having strength adjustme...
- Patent number 11,756,924
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hong-Wei Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of forming a semiconductor device with resisti...
- Patent number 11,437,313
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hong-Wei Chan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240145430
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Te Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR CHIP HAVING STRENGTH ADJUSTME...
- Publication number 20230369285
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hong-Wei Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF FORMING A SEMICONDUCTOR DEVICE WITH RESISTI...
- Publication number 20220359387
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hong-Wei CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20220336583
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Guan-Yao TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR CHIP
- Publication number 20220310559
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hong-Wei Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20220310527
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Te Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method of Forming Same
- Publication number 20220310556
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Te Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20210257295
- Publication date Aug 19, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hong-Wei Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF FORMING A SEMICONDUCTOR DEVICE WITH RESISTI...
- Publication number 20210257296
- Publication date Aug 19, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Hong-Wei CHAN
- H01 - BASIC ELECTRIC ELEMENTS

Hong-Wei Chan

Person

Patents Grantslast 30 patents

Integrated circuit structure and method for forming the same

Structure and method of forming a semiconductor device with resisti...

Interconnect level with high resistance layer and method of forming...

Integrated circuit package and method of forming same

Method of fabricating a semiconductor chip having strength adjustme...

Structure and method of forming a semiconductor device with resisti...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

METHOD OF FABRICATING A SEMICONDUCTOR CHIP HAVING STRENGTH ADJUSTME...

STRUCTURE AND METHOD OF FORMING A SEMICONDUCTOR DEVICE WITH RESISTI...

INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR FORMING THE SAME

METHOD OF FABRICATING A SEMICONDUCTOR CHIP

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

Integrated Circuit Package and Method of Forming Same

SEMICONDUCTOR DEVICE AND METHOD

STRUCTURE AND METHOD OF FORMING A SEMICONDUCTOR DEVICE WITH RESISTI...