Hong Xia Fu

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Wafer process for molded chip scale package (MCSP) with thick backs...
- Patent number 9,245,861
- Issue date Jan 26, 2016
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER PROCESS FOR MOLDED CHIP SCALE PACKAGE (MCSP) WITH THICK BACKS...
- Publication number 20140315350
- Publication date Oct 23, 2014
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS