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last 30 patents
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Patent Grant
Chip packaging structure, and packaging method thereof
Patent number
10,777,477
Issue date
Sep 15, 2020
JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD
Li Zhang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
CHIP PACKAGING STRUCTURE AND CHIP PACKAGING METHOD
Publication number
20230068875
Publication date
Mar 2, 2023
JCET Advanced Packaging Co., LTD.
HONG XU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH-POWER SEMICONDUCTOR CHIP AND PREPARATION METHOD THEREFOR
Publication number
20220166190
Publication date
May 26, 2022
Everbright Institute of Semiconductor Photonics Co.,Ltd.
Shaoyang Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGING STRUCTURE, AND PACKAGING METHOD THEREOF
Publication number
20190214324
Publication date
Jul 11, 2019
JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD
Li ZHANG
H01 - BASIC ELECTRIC ELEMENTS