Hong-Ye Shih

Person

Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming semiconductor device having backside interconnect...
- Patent number 11,823,979
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having backside interconnect structure on thro...
- Patent number 11,056,419
- Issue date Jul 6, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Profile of through via protrusion in 3DIC interconnect
- Patent number 11,004,741
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated circuit structure and method of manufa...
- Patent number 10,672,737
- Issue date Jun 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Profile of through via protrusion in 3DIC interconnect
- Patent number 10,566,237
- Issue date Feb 18, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having backside interconnect structure on thro...
- Patent number 10,510,641
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Profile of through via protrusion in 3DIC interconnect
- Patent number 10,163,705
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-alignment for redistribution layer
- Patent number 10,074,595
- Issue date Sep 11, 2018
- Taiwan Semiconductor Manufacturing Company
- Ku-Feng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-alignment for redistribution layer
- Patent number 9,786,580
- Issue date Oct 10, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ku-Feng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having backside interconnect structure through...
- Patent number 9,449,898
- Issue date Sep 20, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device Having Backside Interconnect Structure on Thr...
- Publication number 20230386976
- Publication date Nov 30, 2023
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Semiconductor Device Having Backside Interconnect...
- Publication number 20210335694
- Publication date Oct 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20200294966
- Publication date Sep 17, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Profile of Through Via Protrusion in 3DIC Interconnect
- Publication number 20200144119
- Publication date May 7, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Backside Interconnect Structure on Thro...
- Publication number 20200006201
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE AND METHOD OF MANUFA...
- Publication number 20190139935
- Publication date May 9, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Profile of Through Via Protrusion in 3DIC Interconnect
- Publication number 20190122927
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-Alignment for Redistribution Layer
- Publication number 20180012825
- Publication date Jan 11, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ku-Feng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Backside Interconnect Structure on Thro...
- Publication number 20170011988
- Publication date Jan 12, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Profile of Through Via Protrusion in 3DIC Interconnect
- Publication number 20150311141
- Publication date Oct 29, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNMENT FOR REDISTRIBUTION LAYER
- Publication number 20150137382
- Publication date May 21, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ku-Feng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING BACKSIDE INTERCONNECT STRUCTURE ON THRO...
- Publication number 20150035159
- Publication date Feb 5, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS

Hong-Ye Shih

Person

Patents Grantslast 30 patents

Method of forming semiconductor device having backside interconnect...

Semiconductor device having backside interconnect structure on thro...

Profile of through via protrusion in 3DIC interconnect

Three-dimensional integrated circuit structure and method of manufa...

Profile of through via protrusion in 3DIC interconnect

Semiconductor device having backside interconnect structure on thro...

Profile of through via protrusion in 3DIC interconnect

Self-alignment for redistribution layer

Self-alignment for redistribution layer

Semiconductor device having backside interconnect structure through...

Patents Applicationslast 30 patents

Semiconductor Device Having Backside Interconnect Structure on Thr...

Method of Forming Semiconductor Device Having Backside Interconnect...

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

Profile of Through Via Protrusion in 3DIC Interconnect

Semiconductor Device Having Backside Interconnect Structure on Thro...

THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE AND METHOD OF MANUFA...

Profile of Through Via Protrusion in 3DIC Interconnect

Self-Alignment for Redistribution Layer

Semiconductor Device Having Backside Interconnect Structure on Thro...

Profile of Through Via Protrusion in 3DIC Interconnect

SELF-ALIGNMENT FOR REDISTRIBUTION LAYER

SEMICONDUCTOR DEVICE HAVING BACKSIDE INTERCONNECT STRUCTURE ON THRO...