Hong Yu

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Method for forming an air gap around a through-silicon via
- Patent number 9,425,127
- Issue date Aug 23, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Hong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid TSV and method for forming the same
- Patent number 9,269,651
- Issue date Feb 23, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Yu Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid TSV and method for forming the same
- Patent number 9,006,102
- Issue date Apr 14, 2015
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Yu Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an air gap around a through-silicon via
- Patent number 8,962,474
- Issue date Feb 24, 2015
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Hong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable contacts
- Patent number 8,916,939
- Issue date Dec 23, 2014
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Hong Yu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Package interconnects
- Patent number 8,883,634
- Issue date Nov 11, 2014
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Hong Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Damascene process for aligning and bonding through-silicon-via base...
- Patent number 8,877,637
- Issue date Nov 4, 2014
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Hong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable contacts
- Patent number 8,519,482
- Issue date Aug 27, 2013
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Hong Yu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated circuit system with via and method of manufacture thereof
- Patent number 8,405,222
- Issue date Mar 26, 2013
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Hong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal robust semiconductor device using HfN as metal gate electro...
- Patent number 7,514,360
- Issue date Apr 7, 2009
- Hong Yu Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HYBRID TSV AND METHOD FOR FORMING THE SAME
- Publication number 20150179547
- Publication date Jun 25, 2015
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Yu Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN AIR GAP AROUND A THROUGH-SILICON VIA
- Publication number 20150069579
- Publication date Mar 12, 2015
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Hong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INTERCONNECTS
- Publication number 20150061085
- Publication date Mar 5, 2015
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Hong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE CONTACTS
- Publication number 20130334616
- Publication date Dec 19, 2013
- GLOBALFOUNDRIER Singapore Pte. Ltd.
- Hong YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIA FOR STACKED WAFER CONNECTIONS
- Publication number 20130119543
- Publication date May 16, 2013
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Hong YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN AIR GAP AROUND A THROUGH-SILICON VIA
- Publication number 20130115769
- Publication date May 9, 2013
- GLOBALFOUNDERIES Singapore Pte. Ltd.
- Hong YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE CONTACTS
- Publication number 20130075823
- Publication date Mar 28, 2013
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Hong YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAMASCENE PROCESS FOR ALIGNING AND BONDING THROUGH-SILICON-VIA BASE...
- Publication number 20130069232
- Publication date Mar 21, 2013
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Hong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INTERCONNECTS
- Publication number 20130001793
- Publication date Jan 3, 2013
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Hong YU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Hybrid TSV and Method for Forming the Same
- Publication number 20120267788
- Publication date Oct 25, 2012
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Yu Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SYSTEM WITH VIA AND METHOD OF MANUFACTURE THEREOF
- Publication number 20110316166
- Publication date Dec 29, 2011
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Hong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL WORK FUNCTION DEVICE WITH STRESSOR LAYER AND METHOD FOR MANUFA...
- Publication number 20090174003
- Publication date Jul 9, 2009
- Interuniversitair Microelektronica Centrum vzw (IMEC)
- Shou-Zen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for manufacturing a CMOS device with dual dielectric layers
- Publication number 20080191286
- Publication date Aug 14, 2008
- Interuniversitair Microelektronica Centrum (IMEC)
- Shou-Zen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal robust semiconductor device using HfN as metal gate electro...
- Publication number 20050205947
- Publication date Sep 22, 2005
- National University of Singapore
- Hong Yu Yu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Method for forming an air gap around a through-silicon via

Hybrid TSV and method for forming the same

Hybrid TSV and method for forming the same

Method for forming an air gap around a through-silicon via

Reliable contacts

Package interconnects

Damascene process for aligning and bonding through-silicon-via base...

Reliable contacts

Integrated circuit system with via and method of manufacture thereof

Thermal robust semiconductor device using HfN as metal gate electro...

Patents Applicationslast 30 patents

HYBRID TSV AND METHOD FOR FORMING THE SAME

METHOD FOR FORMING AN AIR GAP AROUND A THROUGH-SILICON VIA

PACKAGE INTERCONNECTS

RELIABLE CONTACTS

THROUGH SILICON VIA FOR STACKED WAFER CONNECTIONS

METHOD FOR FORMING AN AIR GAP AROUND A THROUGH-SILICON VIA

RELIABLE CONTACTS

DAMASCENE PROCESS FOR ALIGNING AND BONDING THROUGH-SILICON-VIA BASE...

PACKAGE INTERCONNECTS

Hybrid TSV and Method for Forming the Same

INTEGRATED CIRCUIT SYSTEM WITH VIA AND METHOD OF MANUFACTURE THEREOF

DUAL WORK FUNCTION DEVICE WITH STRESSOR LAYER AND METHOD FOR MANUFA...

Methods for manufacturing a CMOS device with dual dielectric layers

Thermal robust semiconductor device using HfN as metal gate electro...