Hong Zhong

Person

New Haven, CT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal conductive material utilizing electrically conductive nanop...
- Patent number 7,550,097
- Issue date Jun 23, 2009
- Momentive Performance Materials, Inc.
- Sandeep Shrikant Tonapi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced boron nitride composition and compositions made therewith
- Patent number 7,527,859
- Issue date May 5, 2009
- Momentive Performance Materials Inc.
- Hong Zhong
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Organic matrices containing nanomaterials to enhance bulk thermal c...
- Patent number 7,013,965
- Issue date Mar 21, 2006
- General Electric Company
- Hong Zhong
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
ENHANCED BORON NITRIDE COMPOSITION AND COMPOSITIONS MADE THEREWITH
- Publication number 20080076856
- Publication date Mar 27, 2008
- GENERAL ELECTRIC COMPANY
- Hong Zhong
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thermally conductive composition and method for preparing the same
- Publication number 20070241303
- Publication date Oct 18, 2007
- General Electric Company
- Hong Zhong
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Energy responsive composition and associated method
- Publication number 20070032610
- Publication date Feb 8, 2007
- General Electric Company
- Sergei Kniajanski
- B60 - VEHICLES IN GENERAL
Information Patent Application
Electronic assemblies and methods of making the same
- Publication number 20060065387
- Publication date Mar 30, 2006
- General Electric Company
- Sandeep Shrikant Tonapi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally conductive compositions and methods of making thereof
- Publication number 20050228097
- Publication date Oct 13, 2005
- General Electric Company
- Hong Zhong
- B82 - NANO-TECHNOLOGY
Information Patent Application
ORGANIC MATRICES CONTAINING NANOMATERIALS TO ENHANCE BULK THERMAL C...
- Publication number 20050161210
- Publication date Jul 28, 2005
- Hong Zhong
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Thin bond-line silicone adhesive composition and method for prepari...
- Publication number 20050148721
- Publication date Jul 7, 2005
- Sandeep Tonapi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thin bond-line silicone adhesive composition and method for prepari...
- Publication number 20050049350
- Publication date Mar 3, 2005
- Sandeep Tonapi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thin bond-line silicone adhesive
- Publication number 20050049357
- Publication date Mar 3, 2005
- Hong Zhong
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thermal conductive material utilizing electrically conductive nanop...
- Publication number 20050045855
- Publication date Mar 3, 2005
- Sandeep Shrikant Tonapi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Person

Patents Grantslast 30 patents

Thermal conductive material utilizing electrically conductive nanop...

Enhanced boron nitride composition and compositions made therewith

Organic matrices containing nanomaterials to enhance bulk thermal c...

Patents Applicationslast 30 patents

ENHANCED BORON NITRIDE COMPOSITION AND COMPOSITIONS MADE THEREWITH

Thermally conductive composition and method for preparing the same

Energy responsive composition and associated method

Electronic assemblies and methods of making the same

Thermally conductive compositions and methods of making thereof

ORGANIC MATRICES CONTAINING NANOMATERIALS TO ENHANCE BULK THERMAL C...

Thin bond-line silicone adhesive composition and method for prepari...

Thin bond-line silicone adhesive composition and method for prepari...

Thin bond-line silicone adhesive

Thermal conductive material utilizing electrically conductive nanop...