Hong-Zong XU

Person

Taoyuan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Electrical device package structure and manufacturing method thereof
- Patent number 11,404,209
- Issue date Aug 2, 2022
- SFI ELECTRONICS TECHNOLOGY INC.
- Ching-Hohn Len
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer varistor and process for producing the same
- Patent number 9,947,444
- Issue date Apr 17, 2018
- SFI Electronics Technology Inc.
- Ching-Hohn Lien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Miniaturized SMD diode package and process for producing the same
- Patent number 9,691,736
- Issue date Jun 27, 2017
- SFI ELECTRONICS TECHNOLOGY INC.
- Ching-Hohn Lien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Miniaturized SMD diode package and process for producing the same
- Patent number 9,691,735
- Issue date Jun 27, 2017
- SFI Electronics Technology Inc.
- Ching-Hohn Lien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-function miniaturized surface-mount device and process for pr...
- Patent number 9,443,825
- Issue date Sep 13, 2016
- SFI ELECTRONICS TECHNOLOGY INC.
- Ching-Hohn Lien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale diode package no containing outer lead pins and process...
- Patent number 9,165,872
- Issue date Oct 20, 2015
- SFI Electronics Technology Inc.
- Ching-Hohn Lien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of multilayer ceramic device
- Patent number 8,363,382
- Issue date Jan 29, 2013
- SFI Electronics Technology Inc.
- Ching-Hohn Lien
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL DEVICE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210280373
- Publication date Sep 9, 2021
- SFI Electronics Technology Inc.
- Ching-Hohn Len
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER VARISTOR AND PROCESS FOR PRODUCING THE SAME
- Publication number 20180090248
- Publication date Mar 29, 2018
- SFI Electronics Technology Inc.
- Ching-Hohn LIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-FUNCTION MINIATURIZED SURFACE-MOUNT DEVICE AND PROCESS FOR PR...
- Publication number 20160240510
- Publication date Aug 18, 2016
- SFI Electronics Technology Inc.
- Ching-Hohn LIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MINIATURIZED SMD DIODE PACKAGE AND PROCESS FOR PRODUCING THE SAME
- Publication number 20160035697
- Publication date Feb 4, 2016
- SFI Electronics Technology Inc.
- Ching-Hohn LIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MINIATURIZED SMD DIODE PACKAGE AND PRSCESS FOR PRODUCING THE SAME
- Publication number 20150200147
- Publication date Jul 16, 2015
- SFI Electronics Technology Inc.
- Ching-Hohn LIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE DIODE PACKAGE NO CONTANING OUTER LEAD PINS AND PROCESS F...
- Publication number 20150123254
- Publication date May 7, 2015
- SFI Electronics Technology Inc.
- Ching-Hohn LIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR PRODUCING ZINC OXIDE VARISTOR
- Publication number 20130011963
- Publication date Jan 10, 2013
- SFI Electronics Technology Inc.
- Ching-Hohn LIEN
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
STRUCTURE OF MULTILAYER CERAMIC DEVICE
- Publication number 20120208040
- Publication date Aug 16, 2012
- SFI Electronics Technology Inc.
- Ching-Hohn LIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for producing zinc oxide varistor
- Publication number 20100117271
- Publication date May 13, 2010
- SFI Electronics Technology Inc.
- Ching-Hohn Lien
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Hong-Zong XU

Person

Patents Grantslast 30 patents

Electrical device package structure and manufacturing method thereof

Multilayer varistor and process for producing the same

Miniaturized SMD diode package and process for producing the same

Miniaturized SMD diode package and process for producing the same

Multi-function miniaturized surface-mount device and process for pr...

Chip scale diode package no containing outer lead pins and process...

Structure of multilayer ceramic device

Patents Applicationslast 30 patents

ELECTRICAL DEVICE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

MULTILAYER VARISTOR AND PROCESS FOR PRODUCING THE SAME

MULTI-FUNCTION MINIATURIZED SURFACE-MOUNT DEVICE AND PROCESS FOR PR...

MINIATURIZED SMD DIODE PACKAGE AND PROCESS FOR PRODUCING THE SAME

MINIATURIZED SMD DIODE PACKAGE AND PRSCESS FOR PRODUCING THE SAME

CHIP SCALE DIODE PACKAGE NO CONTANING OUTER LEAD PINS AND PROCESS F...

PROCESS FOR PRODUCING ZINC OXIDE VARISTOR

STRUCTURE OF MULTILAYER CERAMIC DEVICE

Process for producing zinc oxide varistor