Hongbin Shi

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Electronic package, terminal and method for processing electronic p...
- Patent number 11,367,700
- Issue date Jun 21, 2022
- Huawei Technologies Co., Ltd.
- Hongbin Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-reliability electronic packaging structure, circuit board, and...
- Patent number 11,011,477
- Issue date May 18, 2021
- Huawei Technologies Co., Ltd.
- Hongbin Shi
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT AND ELECTRONIC DEVICE
- Publication number 20230337362
- Publication date Oct 19, 2023
- HUAWEI TECHNOLOGIES CO., LTD.
- Hongbin SHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board Assembly, Electronic Device, and Method for Processin...
- Publication number 20220394853
- Publication date Dec 8, 2022
- Huawei Technologies Co., Ltd
- Hongbin Shi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE, TERMINAL AND METHOD FOR PROCESSING ELECTRONIC P...
- Publication number 20200343210
- Publication date Oct 29, 2020
- Huawei Technologies Co., Ltd
- Hongbin SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Reliability Electronic Packaging Structure, Circuit Board, and...
- Publication number 20190311996
- Publication date Oct 10, 2019
- Huawei Technologies Co., Ltd
- Hongbin Shi
- B32 - LAYERED PRODUCTS