Hongbo ZHU

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Hefei, CN

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,257,668
- Issue date Feb 22, 2022
- Nexchip Semiconductor Co., LTD
- Yongbo Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure
- Patent number 10,930,545
- Issue date Feb 23, 2021
- NEXCHIP SEMICONDUCTOR CORPORATION
- Hongbo Zhu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210375617
- Publication date Dec 2, 2021
- NEXCHIP SEMICONDUCTOR CO., LTD.
- Yongbo FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20200365446
- Publication date Nov 19, 2020
- Nexchip Semiconductor Corporation
- Hongbo ZHU
- H01 - BASIC ELECTRIC ELEMENTS