Hongcheng Yin

Follow

Person

Shenzhen, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Packaging structure
- Patent number 11,462,817
- Issue date Oct 4, 2022
- Huawei Technologies Co., Ltd.
- Heng Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip die package structure and electronic device
- Patent number 11,251,136
- Issue date Feb 15, 2022
- Huawei Technologies Co., Ltd.
- Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Packaging Structure
- Publication number 20210043998
- Publication date Feb 11, 2021
- Huawei Technologies Co., Ltd
- Heng Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-Chip Die Package Structure and Electronic Device
- Publication number 20210013154
- Publication date Jan 14, 2021
- Huawei Technologies Co., Ltd
- Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS