HONGDE DAI

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Wuxi City, CN

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Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE WITH HEAT DISSIPATION PLATE AND MANUFACTURING METHOD T...
- Publication number 20240006339
- Publication date Jan 4, 2024
- STATS ChipPac Semiconductor (Jiangyin) Co., LTD.
- SHUAI YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH HEAT DISSIPATION PLATE AND MANUFACTURING METHOD T...
- Publication number 20240006370
- Publication date Jan 4, 2024
- STATS ChipPac Semiconductor (Jiangyin) Co., LTD.
- ZELONG YU
- H01 - BASIC ELECTRIC ELEMENTS