Hongfei Yan

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Mesa, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Socket with thermal conductor
- Patent number 11,259,399
- Issue date Feb 22, 2022
- Intel Corporation
- Hongfei Yan
- G01 - MEASURING TESTING
Information Patent Grant
Technologies for temperature measurement of a processor
- Patent number 10,318,396
- Issue date Jun 11, 2019
- Intel Corporation
- Jiangqi He
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Rework grid array interposer with direct power
- Patent number 10,211,120
- Issue date Feb 19, 2019
- Intel Corporation
- Russell S. Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test pin, method of manufacturing same, and system containing same
- Patent number 7,521,949
- Issue date Apr 21, 2009
- Intel Corporation
- Hongfei Yan
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
MULTI-ENTRY SOCKET POWER DELIVERY STRUCTURE AND BACKPLATE
- Publication number 20240179832
- Publication date May 30, 2024
- Phil Geng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOCKET WITH THERMAL CONDUCTOR
- Publication number 20190045619
- Publication date Feb 7, 2019
- Intel Corporation
- Hongfei Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Rework grid array interposer with direct power
- Publication number 20170186661
- Publication date Jun 29, 2017
- Intel Corporation
- Russell S. Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SUPPORT STRUCTURES
- Publication number 20170178994
- Publication date Jun 22, 2017
- Intel Corporation
- Michael Hui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR TEMPERATURE MEASUREMENT OF A PROCESSOR
- Publication number 20170091061
- Publication date Mar 30, 2017
- Jiangqi He
- G01 - MEASURING TESTING
Information Patent Application
Modular Multiple Piece Socket For Enhanced Thermal Management
- Publication number 20140187058
- Publication date Jul 3, 2014
- Hongfei Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Test pin, method of manufacturing same, and system containing same
- Publication number 20080278187
- Publication date Nov 13, 2008
- Hongfei Yan
- G01 - MEASURING TESTING