Honghai Zhu

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Method of bonding wires
- Patent number 6,672,503
- Issue date Jan 6, 2004
- ASM Technology Singapore PTE LTD
- Siu Wing Or
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of and apparatus for monitoring a ball forming process
- Patent number 6,660,956
- Issue date Dec 9, 2003
- ASM Technology Singapore PTE
- Michael Armin Boller
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of bonding wires
- Publication number 20020060239
- Publication date May 23, 2002
- ASM Technology Singapore Pte Ltd
- Siu Wing Or
- H01 - BASIC ELECTRIC ELEMENTS