Honghui Wang

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Nantong, CN

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Patents Grantslast 30 patents

Information Patent Grant
Packaging structure of semiconductor chip and formation method thereof
- Patent number 12,119,308
- Issue date Oct 15, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Xiaoyong Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-level packaging structures
- Patent number 10,741,499
- Issue date Aug 11, 2020
- TONGFU MICROELECTRONICS CO., LTD.
- Yujuan Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of reinforcing a conductor soldering point of...
- Patent number 9,837,371
- Issue date Dec 5, 2017
- TONGFU MICROELECTRONICS CO., L,TD.
- Haizhong Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-level packaging methods and structures
- Patent number 9,543,269
- Issue date Jan 10, 2017
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Yujuan Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal contact for semiconductor device
- Patent number 9,379,077
- Issue date Jun 28, 2016
- Nantong Fujitsu Microelectronics Co., Ltd.
- Chang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional system-level packaging methods and structures
- Patent number 9,099,448
- Issue date Aug 4, 2015
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Yujuan Tao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PACKAGING STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20220270982
- Publication date Aug 25, 2022
- TONGFU MICROELECTRONICS CO., LTD.
- Xiaoyong MIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF REINFORCING A CONDUCTOR SOLDERING POINT OF...
- Publication number 20170207189
- Publication date Jul 20, 2017
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Haizhong SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-LEVEL PACKAGING STRUCTURES
- Publication number 20170077035
- Publication date Mar 16, 2017
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Yujuan Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND PACKAGING METHOD
- Publication number 20150303159
- Publication date Oct 22, 2015
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Chang-Ming LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-LEVEL PACKAGING METHODS AND STRUCTURES
- Publication number 20130320534
- Publication date Dec 5, 2013
- Yujuan Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SYSTEM-LEVEL PACKAGING METHODS AND STRUCTURES
- Publication number 20130320535
- Publication date Dec 5, 2013
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Yujuan Tao
- H01 - BASIC ELECTRIC ELEMENTS