Hongjie WANG

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Wuxi City, CN

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing fan out wafer level package
- Patent number 9,773,684
- Issue date Sep 26, 2017
- National Center for Advanced Packaging Co., Ltd.
- Hongjie Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING FAN OUT WAFER LEVEL PACKAGE
- Publication number 20160218020
- Publication date Jul 28, 2016
- National Center for Advanced Packaging Co., Ltd.
- Hongjie WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fine Pitch stud POP Structure and Method
- Publication number 20150035147
- Publication date Feb 5, 2015
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Jiangang LU
- H01 - BASIC ELECTRIC ELEMENTS