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Hongjin Jiang
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Chandler, AZ, US
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Patents Grants
last 30 patents
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Patent Grant
Hybrid solder and filled paste in microelectronic packaging
Patent number
8,920,934
Issue date
Dec 30, 2014
Intel Corporation
Hongjin Jiang
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Patents Applications
last 30 patents
Information
Patent Application
SUBSTRATE ON SUBSTRATE PACKAGE
Publication number
20170053858
Publication date
Feb 23, 2017
Intel Corporation
Jan Krajniak
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
On Package Floating Metal/Stiffener Grounding to Mitigate RFI and S...
Publication number
20160268213
Publication date
Sep 15, 2016
Intel Corporation
Hongjin JIANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID INTERCONNECT FOR LOW TEMPERATURE ATTACH
Publication number
20160260679
Publication date
Sep 8, 2016
Intel Corporation
Kabirkumar J. Mirpuri
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID SOLDER AND FILLED PASTE IN MICROELECTRONIC PACKAGING
Publication number
20140291843
Publication date
Oct 2, 2014
Hongjin Jiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW TEMPERATURE/HIGH TEMPERATURE SOLDER HYBRID SOLDER INTERCONNECTS
Publication number
20140151096
Publication date
Jun 5, 2014
Hongjin Jiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONTROLLED SOLDER HEIGHT PACKAGES AND ASSEMBLY PROCESSES
Publication number
20140091457
Publication date
Apr 3, 2014
Hongjin JIANG
H01 - BASIC ELECTRIC ELEMENTS