Hongjun Yao

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Sunnyvale, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Land grid array connector including heterogeneous contact elements
- Patent number 7,070,419
- Issue date Jul 4, 2006
- Neoconix Inc.
- Dirk D. Brown
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Remountable connector for land grid array packages
- Patent number 6,916,181
- Issue date Jul 12, 2005
- Neoconix, Inc.
- Dirk D. Brown
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuitized connector for land grid array
- Patent number 6,869,290
- Issue date Mar 22, 2005
- Neoconix, Inc.
- Dirk D. Brown
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Circuitized connector for land grid array
- Publication number 20040253875
- Publication date Dec 16, 2004
- EPIC Technology Inc.
- Dirk D. Brown
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REMOUNTABLE CONNECTOR FOR LAND GRID ARRAY PACKAGES
- Publication number 20040253845
- Publication date Dec 16, 2004
- Dirk D. Brown
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Land grid array connector including heterogeneous contact elements
- Publication number 20040253846
- Publication date Dec 16, 2004
- EPIC Technology Inc.
- Dirk D. Brown
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR