Honglin WANG

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Hikone-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Packaging material and molded case
- Patent number 10,008,700
- Issue date Jun 26, 2018
- Showa Denko Packaging Co., Ltd.
- Yuji Minamibori
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Molding packaging material
- Patent number 9,812,678
- Issue date Nov 7, 2017
- Showa Denko Packaging Co., Ltd.
- Yuji Minamibori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molding packaging material and molded case
- Patent number 9,649,827
- Issue date May 16, 2017
- Showa Denko Packaging Co., Ltd.
- Honglin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molding material for package
- Patent number 9,553,284
- Issue date Jan 24, 2017
- Showa Denko Packaging Co., Ltd.
- Yuji Minamibori
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDING PACKAGING MATERIAL AND MOLDED CASE
- Publication number 20160089861
- Publication date Mar 31, 2016
- SHOWA DENKO PACKAGING CO., LTD.
- Honglin WANG
- B32 - LAYERED PRODUCTS
Information Patent Application
MOLDING MATERIAL FOR PACKAGE
- Publication number 20150104593
- Publication date Apr 16, 2015
- SHOWA DENKO PACKAGING CO., LTD.
- Yuji MINAMIBORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDING PACKAGING MATERIAL
- Publication number 20150044546
- Publication date Feb 12, 2015
- SHOWA DENKO PACKAGING CO., LTD.
- Yuji MINAMIBORI
- B32 - LAYERED PRODUCTS
Information Patent Application
PACKAGING MATERIAL AND MOLDED CASE
- Publication number 20150030910
- Publication date Jan 29, 2015
- SHOWA DENKO PACKAGING CO., LTD.
- Yuji MINAMIBORI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL