Hongmei Liao

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Analog receiver front-end with variable gain amplifier embedded in...
- Patent number 11,863,356
- Issue date Jan 2, 2024
- QUALCOMM Incorporated
- Miao Li
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Adding symmetrical filling material in an integrated circuit layout
- Patent number 9,293,408
- Issue date Mar 22, 2016
- QUALCOMM Incorporated
- Hongmei Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method to design and test a yield sensitive circuit
- Patent number 9,081,932
- Issue date Jul 14, 2015
- QUALCOMM Incorporated
- Hongmei Liao
- G01 - MEASURING TESTING
Information Patent Grant
Thermal and stress gradient based RC extraction, timing and power a...
- Patent number 8,797,054
- Issue date Aug 5, 2014
- QUALCOMM Incorporated
- Hongmei Liao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Generating cutting forms along current flow direction in a circuit...
- Patent number 8,103,994
- Issue date Jan 24, 2012
- QUALCOMM Incorporated
- Hongmei Liao
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method and apparatus for insertion of filling forms within a design...
- Patent number 7,681,170
- Issue date Mar 16, 2010
- QUALCOMM Incorporated
- Hongmei Liao
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT BUMP INTEGRATED WITH TCOIL
- Publication number 20240203871
- Publication date Jun 20, 2024
- QUALCOMM Incorporated
- Hongmei LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANALOG RECEIVER FRONT-END WITH VARIABLE GAIN AMPLIFIER EMBEDDED IN...
- Publication number 20230246885
- Publication date Aug 3, 2023
- QUALCOMM Incorporated
- Miao LI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SYSTEM AND METHOD TO DESIGN AND TEST A YIELD SENSITIVE CIRCUIT
- Publication number 20140223389
- Publication date Aug 7, 2014
- QUALCOMM Incorporated
- Hongmei Liao
- G01 - MEASURING TESTING
Information Patent Application
THERMAL AND STRESS GRADIENT BASED RC EXTRACTION, TIMING AND POWER A...
- Publication number 20130033277
- Publication date Feb 7, 2013
- QUALCOMM Incorporated
- Hongmei Liao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DEFECT AND YIELD PREDICTION FOR SEGMENTS OF AN INTEGRATED CIRCUIT
- Publication number 20120110531
- Publication date May 3, 2012
- QUALCOMM Incorporated
- Hongmei Liao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Adding Symmetrical Filling Material In An Integrated Circuit Layout
- Publication number 20110042818
- Publication date Feb 24, 2011
- QUALCOMM Incorporated
- Hongmei Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Generating Cutting Forms Along Current Flow Direction In A Circuit...
- Publication number 20100179679
- Publication date Jul 15, 2010
- QUALCOMM Incorporated
- Hongmei Liao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method and apparatus for insertion of filling forms within a design...
- Publication number 20070186202
- Publication date Aug 9, 2007
- Hongmei Liao
- G06 - COMPUTING CALCULATING COUNTING

Hongmei Liao

Person

Patents Grantslast 30 patents

Analog receiver front-end with variable gain amplifier embedded in...

Adding symmetrical filling material in an integrated circuit layout

System and method to design and test a yield sensitive circuit

Thermal and stress gradient based RC extraction, timing and power a...

Generating cutting forms along current flow direction in a circuit...

Method and apparatus for insertion of filling forms within a design...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT BUMP INTEGRATED WITH TCOIL

ANALOG RECEIVER FRONT-END WITH VARIABLE GAIN AMPLIFIER EMBEDDED IN...

SYSTEM AND METHOD TO DESIGN AND TEST A YIELD SENSITIVE CIRCUIT

THERMAL AND STRESS GRADIENT BASED RC EXTRACTION, TIMING AND POWER A...

DEFECT AND YIELD PREDICTION FOR SEGMENTS OF AN INTEGRATED CIRCUIT

Adding Symmetrical Filling Material In An Integrated Circuit Layout

Generating Cutting Forms Along Current Flow Direction In A Circuit...

Method and apparatus for insertion of filling forms within a design...