Hongqi Li

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multitier arrangements of integrated devices, and methods of formin...
- Patent number 12,144,188
- Issue date Nov 12, 2024
- Micron Technology, Inc.
- Lei Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices including floating vias
- Patent number 11,770,928
- Issue date Sep 26, 2023
- Micron Technology, Inc.
- Hongqi Li
- G11 - INFORMATION STORAGE
Information Patent Grant
Slit oxide and via formation techniques
- Patent number 11,764,147
- Issue date Sep 19, 2023
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multitier arrangements of integrated devices, and methods of formin...
- Patent number 11,600,666
- Issue date Mar 7, 2023
- Micron Technology, Inc.
- Lei Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of electrodes for memory cells
- Patent number 11,545,623
- Issue date Jan 3, 2023
- Micron Technology, Inc.
- Pengyuan Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-pitch vias for semiconductor devices and associated devices and...
- Patent number 11,437,435
- Issue date Sep 6, 2022
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slit oxide and via formation techniques
- Patent number 11,367,681
- Issue date Jun 21, 2022
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices including floating vias and related systems and methods
- Patent number 11,355,508
- Issue date Jun 7, 2022
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive interconnect structures incorporating negative thermal e...
- Patent number 11,011,420
- Issue date May 18, 2021
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multitier arrangements of integrated devices, and methods of formin...
- Patent number 10,957,741
- Issue date Mar 23, 2021
- Micron Technology, Inc.
- Lei Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect assemblies with through-silicon vias and stress-relief...
- Patent number 10,847,442
- Issue date Nov 24, 2020
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of electrodes for memory cells
- Patent number 10,825,987
- Issue date Nov 3, 2020
- Micron Technology, Inc.
- Pengyuan Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive interconnect structures incorporating negative thermal e...
- Patent number 10,546,777
- Issue date Jan 28, 2020
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing apparatuses and polishing methods
- Patent number 10,543,579
- Issue date Jan 28, 2020
- Micron Technology, Inc.
- Jian Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping poly channel pillars in stacked circuits
- Patent number 10,319,678
- Issue date Jun 11, 2019
- Intel Corporation
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing apparatuses
- Patent number 10,286,517
- Issue date May 14, 2019
- Micron Technology, Inc.
- Jian Zhou
- B24 - GRINDING POLISHING
Information Patent Grant
Conductive interconnect structures incorporating negative thermal e...
- Patent number 9,922,875
- Issue date Mar 20, 2018
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor constructions and methods of forming intersecting lin...
- Patent number 9,911,643
- Issue date Mar 6, 2018
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low capacitance interconnect structures and associated systems and...
- Patent number 9,911,653
- Issue date Mar 6, 2018
- Micron Technology, Inc.
- Jin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive interconnect structures incorporating negative thermal e...
- Patent number 9,754,825
- Issue date Sep 5, 2017
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices, systems and methods for manufacturing through-substrate vi...
- Patent number 9,627,295
- Issue date Apr 18, 2017
- Micron Technology, Inc.
- Anurag Jindal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low capacitance interconnect structures and associated systems and...
- Patent number 9,613,864
- Issue date Apr 4, 2017
- Micron Technology, Inc.
- Jin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a metal cap in a semiconductor memory device
- Patent number 9,577,192
- Issue date Feb 21, 2017
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Muralikrishnan Balakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor constructions
- Patent number 9,391,001
- Issue date Jul 12, 2016
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit substrates comprising through-substrate vias and...
- Patent number 9,330,975
- Issue date May 3, 2016
- Micron Technology, Inc.
- Anurag Jindal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices, systems and methods for manufacturing through-substrate vi...
- Patent number 9,305,865
- Issue date Apr 5, 2016
- Micron Technology, Inc.
- Anurag Jindal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping poly channel pillars in stacked circuits
- Patent number 9,263,459
- Issue date Feb 16, 2016
- Intel Corporation
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive interconnect structures incorporating negative thermal e...
- Patent number 9,099,442
- Issue date Aug 4, 2015
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of exposing conductive vias of semiconductor devices and as...
- Patent number 9,034,752
- Issue date May 19, 2015
- Micron Technology, Inc.
- Hongqi Li
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Post-tungsten CMP cleaning solution and method of using the same
- Patent number 8,911,558
- Issue date Dec 16, 2014
- Nanya Technology Corp.
- Hongqi Li
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...

Patents Applicationslast 30 patents

Information Patent Application
Multitier Arrangements of Integrated Devices, and Methods of Formin...
- Publication number 20230165017
- Publication date May 25, 2023
- Micron Technology, Inc.
- Lei Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-PITCH VIAS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED DEVICES AND...
- Publication number 20230005991
- Publication date Jan 5, 2023
- Micron Technology, Inc.
- Hongqi Li
- G11 - INFORMATION STORAGE
Information Patent Application
DEVICES INCLUDING FLOATING VIAS
- Publication number 20220271052
- Publication date Aug 25, 2022
- Micron Technology, Inc.
- Hongqi Li
- G11 - INFORMATION STORAGE
Information Patent Application
DEVICES INCLUDING FLOATING VIAS AND RELATED SYSTEMS AND METHODS
- Publication number 20220052061
- Publication date Feb 17, 2022
- Micron Technology, Inc.
- Hongqi Li
- G11 - INFORMATION STORAGE
Information Patent Application
ON-PITCH VIAS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED DEVICES AND...
- Publication number 20220037400
- Publication date Feb 3, 2022
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLIT OXIDE AND VIA FORMATION TECHNIQUES
- Publication number 20220020685
- Publication date Jan 20, 2022
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF EXPOSING CONDUCTIVE VIAS OF SEMICONDUCTOR DEVICES AND RE...
- Publication number 20210183697
- Publication date Jun 17, 2021
- Micron Technology, Inc.
- Hongqi Li
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Multitier Arrangements of Integrated Devices, and Methods of Formin...
- Publication number 20210167132
- Publication date Jun 3, 2021
- Micron Technology, Inc.
- Lei Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF ELECTRODES FOR MEMORY CELLS
- Publication number 20210098697
- Publication date Apr 1, 2021
- Micron Technology, Inc.
- Pengyuan Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multitier Arrangements of Integrated Devices, and Methods of Formin...
- Publication number 20200350370
- Publication date Nov 5, 2020
- Micron Technology, Inc.
- Lei Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLIT OXIDE AND VIA FORMATION TECHNIQUES
- Publication number 20200243440
- Publication date Jul 30, 2020
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE INTERCONNECT STRUCTURES INCORPORATING NEGATIVE THERMAL E...
- Publication number 20200235007
- Publication date Jul 23, 2020
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF ELECTRODES FOR MEMORY CELLS
- Publication number 20190378975
- Publication date Dec 12, 2019
- Micron Technology, Inc.
- Pengyuan Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polishing Apparatuses and Polishing Methods
- Publication number 20190232457
- Publication date Aug 1, 2019
- Micron Technology, Inc.
- Jian Zhou
- G01 - MEASURING TESTING
Information Patent Application
Polishing Apparatuses and Polishing Methods
- Publication number 20190047109
- Publication date Feb 14, 2019
- Micron Technology, Inc.
- Jian Zhou
- B24 - GRINDING POLISHING
Information Patent Application
CONDUCTIVE INTERCONNECT STRUCTURES INCORPORATING NEGATIVE THERMAL E...
- Publication number 20180174902
- Publication date Jun 21, 2018
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE INTERCONNECT STRUCTURES INCORPORATING NEGATIVE THERMAL E...
- Publication number 20170316974
- Publication date Nov 2, 2017
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW CAPACITANCE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AND...
- Publication number 20170162440
- Publication date Jun 8, 2017
- Micron Technology, Inc.
- Jin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A METAL CAP IN A SEMICONDUCTOR MEMORY DEVICE
- Publication number 20170133585
- Publication date May 11, 2017
- Sony Semiconductor Solutions Corporation
- Muralikrishnan Balakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Constructions and Methods of Forming Intersecting Lin...
- Publication number 20160293482
- Publication date Oct 6, 2016
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPPING POLY CHANNEL PILLARS IN STACKED CIRCUITS
- Publication number 20160247756
- Publication date Aug 25, 2016
- Intel Corporation
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES, SYSTEMS AND METHODS FOR MANUFACTURING THROUGH-SUBSTRATE VI...
- Publication number 20160190042
- Publication date Jun 30, 2016
- Micron Technology, Inc.
- Anurag Jindal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW CAPACITANCE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AND...
- Publication number 20160111372
- Publication date Apr 21, 2016
- Micron Technology, Inc.
- Jin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE INTERCONNECT STRUCTURES INCORPORATING NEGATIVE THERMAL E...
- Publication number 20150340282
- Publication date Nov 26, 2015
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A METAL CAP IN A SEMICONDUCTOR MEMORY DEVICE
- Publication number 20150340247
- Publication date Nov 26, 2015
- SONY CORPORATION
- Muralikrishnan Balakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT ASSEMBLIES WITH THROUGH-SILICON VIAS AND STRESS-RELIEF...
- Publication number 20150243583
- Publication date Aug 27, 2015
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF EXPOSING CONDUCTIVE VIAS OF SEMICONDUCTOR DEVICES AND RE...
- Publication number 20150145146
- Publication date May 28, 2015
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES, SYSTEMS AND METHODS FOR MANUFACTURING THROUGH-SUBSTRATE VI...
- Publication number 20150115445
- Publication date Apr 30, 2015
- Micron Technology, Inc.
- Anurag Jindal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Constructions
- Publication number 20150054164
- Publication date Feb 26, 2015
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE INTERCONNECT STRUCTURES INCORPORATING NEGATIVE THERMAL E...
- Publication number 20150035150
- Publication date Feb 5, 2015
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Multitier arrangements of integrated devices, and methods of formin...

Devices including floating vias

Slit oxide and via formation techniques

Multitier arrangements of integrated devices, and methods of formin...

Fabrication of electrodes for memory cells

On-pitch vias for semiconductor devices and associated devices and...

Slit oxide and via formation techniques

Devices including floating vias and related systems and methods

Conductive interconnect structures incorporating negative thermal e...

Multitier arrangements of integrated devices, and methods of formin...

Interconnect assemblies with through-silicon vias and stress-relief...

Fabrication of electrodes for memory cells

Conductive interconnect structures incorporating negative thermal e...

Polishing apparatuses and polishing methods

Capping poly channel pillars in stacked circuits

Polishing apparatuses

Conductive interconnect structures incorporating negative thermal e...

Semiconductor constructions and methods of forming intersecting lin...

Low capacitance interconnect structures and associated systems and...

Conductive interconnect structures incorporating negative thermal e...

Devices, systems and methods for manufacturing through-substrate vi...

Low capacitance interconnect structures and associated systems and...

Method for forming a metal cap in a semiconductor memory device

Semiconductor constructions

Integrated circuit substrates comprising through-substrate vias and...

Devices, systems and methods for manufacturing through-substrate vi...

Capping poly channel pillars in stacked circuits

Conductive interconnect structures incorporating negative thermal e...

Methods of exposing conductive vias of semiconductor devices and as...

Post-tungsten CMP cleaning solution and method of using the same

Patents Applicationslast 30 patents

Multitier Arrangements of Integrated Devices, and Methods of Formin...

ON-PITCH VIAS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED DEVICES AND...

DEVICES INCLUDING FLOATING VIAS

DEVICES INCLUDING FLOATING VIAS AND RELATED SYSTEMS AND METHODS

ON-PITCH VIAS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED DEVICES AND...

SLIT OXIDE AND VIA FORMATION TECHNIQUES

METHODS OF EXPOSING CONDUCTIVE VIAS OF SEMICONDUCTOR DEVICES AND RE...

Multitier Arrangements of Integrated Devices, and Methods of Formin...

FABRICATION OF ELECTRODES FOR MEMORY CELLS

Multitier Arrangements of Integrated Devices, and Methods of Formin...

SLIT OXIDE AND VIA FORMATION TECHNIQUES

CONDUCTIVE INTERCONNECT STRUCTURES INCORPORATING NEGATIVE THERMAL E...

FABRICATION OF ELECTRODES FOR MEMORY CELLS

Polishing Apparatuses and Polishing Methods

Polishing Apparatuses and Polishing Methods

CONDUCTIVE INTERCONNECT STRUCTURES INCORPORATING NEGATIVE THERMAL E...

CONDUCTIVE INTERCONNECT STRUCTURES INCORPORATING NEGATIVE THERMAL E...

LOW CAPACITANCE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AND...

METHOD FOR FORMING A METAL CAP IN A SEMICONDUCTOR MEMORY DEVICE

Semiconductor Constructions and Methods of Forming Intersecting Lin...

CAPPING POLY CHANNEL PILLARS IN STACKED CIRCUITS

DEVICES, SYSTEMS AND METHODS FOR MANUFACTURING THROUGH-SUBSTRATE VI...

LOW CAPACITANCE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AND...

CONDUCTIVE INTERCONNECT STRUCTURES INCORPORATING NEGATIVE THERMAL E...

METHOD FOR FORMING A METAL CAP IN A SEMICONDUCTOR MEMORY DEVICE

INTERCONNECT ASSEMBLIES WITH THROUGH-SILICON VIAS AND STRESS-RELIEF...

METHODS OF EXPOSING CONDUCTIVE VIAS OF SEMICONDUCTOR DEVICES AND RE...

DEVICES, SYSTEMS AND METHODS FOR MANUFACTURING THROUGH-SUBSTRATE VI...

Semiconductor Constructions

CONDUCTIVE INTERCONNECT STRUCTURES INCORPORATING NEGATIVE THERMAL E...