Hongqing Shan

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Low cost high throughput processing platform
- Patent number 8,668,422
- Issue date Mar 11, 2014
- Mattson Technology, Inc.
- Leszek Niewmierzycki
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Advanced low cost high throughput processing platform
- Patent number 7,658,586
- Issue date Feb 9, 2010
- Mattson Technology, Inc.
- Leszek Niewmierzycki
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Low cost high throughput processing platform
- Patent number 7,563,068
- Issue date Jul 21, 2009
- Mattson Technology, Inc.
- Leszek Niewmierzycki
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Apparatus for uniformly etching a dielectric layer
- Patent number 7,316,761
- Issue date Jan 8, 2008
- Applied Materials, Inc.
- Kenny L. Doan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas flow division in a wafer processing system having multiple cham...
- Patent number 6,913,652
- Issue date Jul 5, 2005
- Applied Materials, Inc.
- Hongqing Shan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Interferometric endpoint detection in a substrate etching process
- Patent number 6,905,624
- Issue date Jun 14, 2005
- Applied Materials, Inc.
- Coriolan I. Frum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic barrier for plasma in chamber exhaust
- Patent number 6,863,835
- Issue date Mar 8, 2005
- James D. Carducci
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Highly selective process for etching oxide over nitride using hexaf...
- Patent number 6,849,193
- Issue date Feb 1, 2005
- Hoiman Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monitoring substrate processing using reflected radiation
- Patent number 6,831,742
- Issue date Dec 14, 2004
- Applied Materials, Inc.
- Zhifeng Sui
- G01 - MEASURING TESTING
Information Patent Grant
Monitoring dimensions of features at different locations in the pro...
- Patent number 6,829,056
- Issue date Dec 7, 2004
- Michael Barnes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhancement of silicon oxide etch rate and nitride selectivity usin...
- Patent number 6,797,189
- Issue date Sep 28, 2004
- Hoiman (Raymond) Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic barrier for plasma in chamber exhaust
- Patent number 6,773,544
- Issue date Aug 10, 2004
- James D. Carducci
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of etching a trench in a silicon-containing dielectric material
- Patent number 6,686,293
- Issue date Feb 3, 2004
- Applied Materials, Inc.
- Yunsang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetically enhanced plasma oxide etch using hexafluorobutadiene
- Patent number 6,613,689
- Issue date Sep 2, 2003
- Applied Materials, Inc.
- Jingbao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for etching oxide using hexafluorobutadiene or related fluo...
- Patent number 6,602,434
- Issue date Aug 5, 2003
- Applied Materials, Inc.
- Hoiman (Raymond) Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetically enhanced plasma apparatus and method with enhanced pla...
- Patent number 6,521,082
- Issue date Feb 18, 2003
- Applied Materials Inc.
- Michael S Barnes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetically enhanced plasma etch process using a heavy fluorocarbo...
- Patent number 6,451,703
- Issue date Sep 17, 2002
- Applied Materials, Inc.
- Jingbao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate cleaning process
- Patent number 6,440,864
- Issue date Aug 27, 2002
- Applied Materials Inc.
- Thomas J. Kropewnicki
- B08 - CLEANING
Information Patent Grant
Process for etching oxide using a hexafluorobutadiene and manifesti...
- Patent number 6,387,287
- Issue date May 14, 2002
- Applied Materials, Inc.
- Hoiman Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxide/nitride etching having high selectivity to photoresist
- Patent number 6,362,109
- Issue date Mar 26, 2002
- Applied Materials, Inc.
- Yungsang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma pretreatment of photoresist in an oxide etch process
- Patent number 6,326,307
- Issue date Dec 4, 2001
- Appllied Materials, Inc.
- Roger A. Lindley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for controlling plasma uniformity in a semicon...
- Patent number 6,232,236
- Issue date May 15, 2001
- Applied Materials, Inc.
- Hongqing Shan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF PATTERNING A THIN-FILM PHOTOVOLTAIC LAYER STACK
- Publication number 20230080774
- Publication date Mar 16, 2023
- NICE SOLAR ENERGY GMBH
- Shuping Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Cost High Throughput Processing Platform
- Publication number 20070175864
- Publication date Aug 2, 2007
- Leszek Niewmierzycki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE CONTROLLED SEMICONDUCTOR PROCESSING CHAMBER LINER
- Publication number 20070091535
- Publication date Apr 26, 2007
- APPLIED MATERIALS, INC.
- Hamid Noorbakhsh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low cost high throughput processing platform
- Publication number 20060045664
- Publication date Mar 2, 2006
- Leszek Niewmierzycki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced low cost high throughput processing platform
- Publication number 20060039781
- Publication date Feb 23, 2006
- Leszek Niewmierzycki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated low k dielectrics and etch stops
- Publication number 20050023694
- Publication date Feb 3, 2005
- Claes H. Bjorkman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Interferometric endpoint detection in a substrate etching process
- Publication number 20050006341
- Publication date Jan 13, 2005
- APPLIED MATERIALS, INC.
- Coriolan I. Frum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric etch chamber with expanded process window
- Publication number 20050003675
- Publication date Jan 6, 2005
- James D. Carducci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for uniformly etching a dielectric layer
- Publication number 20040149394
- Publication date Aug 5, 2004
- APPLIED MATERIALS, INC.
- Kenny L. Doan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Promotion of independence between degree of dissociation of reactiv...
- Publication number 20040011464
- Publication date Jan 22, 2004
- APPLIED MATERIALS, INC.
- Hongqing Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ashable layers for reducing critical dimensions of integrated circu...
- Publication number 20030219988
- Publication date Nov 27, 2003
- APPLIED MATERIALS, INC.
- Hongqing Shan
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD OF ETCHING A TRENCH IN A SILICON-CONTAINING DIELECTRIC MATERIAL
- Publication number 20030211750
- Publication date Nov 13, 2003
- Yunsang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Energizing gas for substrate processing with shockwaves
- Publication number 20030141178
- Publication date Jul 31, 2003
- APPLIED MATERIALS, INC.
- Hongqing Shan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Dielectric etch chamber with expanded process window
- Publication number 20030038111
- Publication date Feb 27, 2003
- APPLIED MATERIALS, INC.
- James D. Carducci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Highly selective process for etching oxide over nitride using hexaf...
- Publication number 20030000913
- Publication date Jan 2, 2003
- Hoiman Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCEMENT OF SILICON OXIDE ETCH RATE AND NITRIDE SELECTIVITY USIN...
- Publication number 20020175144
- Publication date Nov 28, 2002
- HOIMAN(RAYMOND) HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Magnetically enhanced plasma oxide etch using hexafluorobutadiene
- Publication number 20020173162
- Publication date Nov 21, 2002
- Jingbao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitively coupled reactive ion etch plasma reactor with overhead...
- Publication number 20020101167
- Publication date Aug 1, 2002
- APPLIED MATERIALS, INC.
- Hongqing Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Intergrated low k dielectrics and etch stops
- Publication number 20020084257
- Publication date Jul 4, 2002
- APPLIED MATERIALS, INC.
- Claes H. Bjorkman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Integrated low k dielectrics and etch stops
- Publication number 20020074309
- Publication date Jun 20, 2002
- APPLIED MATERIALS, INC.
- Claes H. Bjorkman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Temperature controlled semiconductor processing chamber liner
- Publication number 20020069970
- Publication date Jun 13, 2002
- APPLIED MATERIALS, INC.
- Hamid Noorbakhsh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Magnetic barrier for plasma in chamber exhaust
- Publication number 20010032590
- Publication date Oct 25, 2001
- APPLIED MATERIALS, INC.
- James D. Carducci
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Magnetic barrier for plasma in chamber exhaust
- Publication number 20010032591
- Publication date Oct 25, 2001
- APPLIED MATERIALS, INC.
- James D. Carducci
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Apparatus and method for controlling plasma uniformity in a semicon...
- Publication number 20010009139
- Publication date Jul 26, 2001
- Hongqing Shan
- H01 - BASIC ELECTRIC ELEMENTS

Hongqing Shan

Person

Patents Grantslast 30 patents

Low cost high throughput processing platform

Advanced low cost high throughput processing platform

Low cost high throughput processing platform

Apparatus for uniformly etching a dielectric layer

Gas flow division in a wafer processing system having multiple cham...

Interferometric endpoint detection in a substrate etching process

Magnetic barrier for plasma in chamber exhaust

Highly selective process for etching oxide over nitride using hexaf...

Monitoring substrate processing using reflected radiation

Monitoring dimensions of features at different locations in the pro...

Enhancement of silicon oxide etch rate and nitride selectivity usin...

Magnetic barrier for plasma in chamber exhaust

Method of etching a trench in a silicon-containing dielectric material

Magnetically enhanced plasma oxide etch using hexafluorobutadiene

Process for etching oxide using hexafluorobutadiene or related fluo...

Magnetically enhanced plasma apparatus and method with enhanced pla...

Magnetically enhanced plasma etch process using a heavy fluorocarbo...

Substrate cleaning process

Process for etching oxide using a hexafluorobutadiene and manifesti...

Oxide/nitride etching having high selectivity to photoresist

Plasma pretreatment of photoresist in an oxide etch process

Apparatus and method for controlling plasma uniformity in a semicon...

Patents Applicationslast 30 patents

METHOD OF PATTERNING A THIN-FILM PHOTOVOLTAIC LAYER STACK

Low Cost High Throughput Processing Platform

TEMPERATURE CONTROLLED SEMICONDUCTOR PROCESSING CHAMBER LINER

Low cost high throughput processing platform

Advanced low cost high throughput processing platform

Integrated low k dielectrics and etch stops

Interferometric endpoint detection in a substrate etching process

Dielectric etch chamber with expanded process window

Apparatus for uniformly etching a dielectric layer

Promotion of independence between degree of dissociation of reactiv...

Ashable layers for reducing critical dimensions of integrated circu...

METHOD OF ETCHING A TRENCH IN A SILICON-CONTAINING DIELECTRIC MATERIAL

Energizing gas for substrate processing with shockwaves

Dielectric etch chamber with expanded process window

Highly selective process for etching oxide over nitride using hexaf...

ENHANCEMENT OF SILICON OXIDE ETCH RATE AND NITRIDE SELECTIVITY USIN...

Magnetically enhanced plasma oxide etch using hexafluorobutadiene

Capacitively coupled reactive ion etch plasma reactor with overhead...

Intergrated low k dielectrics and etch stops

Integrated low k dielectrics and etch stops

Temperature controlled semiconductor processing chamber liner

Magnetic barrier for plasma in chamber exhaust

Magnetic barrier for plasma in chamber exhaust

Apparatus and method for controlling plasma uniformity in a semicon...