Hongtao Gao

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor device with small contact footprint and the pre...
- Patent number 10,504,823
- Issue date Dec 10, 2019
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Hongtao Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with small gate clip and assembly method
- Patent number 9,679,833
- Issue date Jun 13, 2017
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with small contact footprint and the pre...
- Patent number 9,646,920
- Issue date May 9, 2017
- ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN), LTD
- Hongtao Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with small gate clip and assembly method
- Patent number 9,472,491
- Issue date Oct 18, 2016
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MCSP power semiconductor devices and preparation methods thereof
- Patent number 9,318,424
- Issue date Apr 19, 2016
- Alpha and Omega Semiconductor Incorporated
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top-exposed semiconductor package and the manufacturing method
- Patent number 9,245,831
- Issue date Jan 26, 2016
- Alpha and Omega Semiconductor (Cayman) LTD
- Yan Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with small gate clip and assembly method
- Patent number 9,171,788
- Issue date Oct 27, 2015
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-small chip package and method for manufacturing the same
- Patent number 8,704,344
- Issue date Apr 22, 2014
- Diodes Incorporated
- Hongtao Gao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER SEMICONDUCTOR DEVICE WITH SMALL CONTACT FOOTPRINT AND THE PRE...
- Publication number 20170186675
- Publication date Jun 29, 2017
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Hongtao Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SMALL GATE CLIP AND ASSEMBLY METHOD
- Publication number 20160379918
- Publication date Dec 29, 2016
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SMALL GATE CLIP AND ASSEMBLY METHOD
- Publication number 20160093559
- Publication date Mar 31, 2016
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MCSP POWER SEMICONDUCTOR DEVICES AND PREPARATION METHODS THEREOF
- Publication number 20160035653
- Publication date Feb 4, 2016
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE WITH SMALL CONTACT FOOTPRINT AND THE PRE...
- Publication number 20150357268
- Publication date Dec 10, 2015
- Alpha and Omega Semiconductor (Cayman), Ltd
- Hongtao Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-SMALL CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130147029
- Publication date Jun 13, 2013
- DIODES INCORPORATED
- Hongtao Gao
- H01 - BASIC ELECTRIC ELEMENTS

Hongtao Gao

Person

Patents Grantslast 30 patents

Power semiconductor device with small contact footprint and the pre...

Semiconductor package with small gate clip and assembly method

Power semiconductor device with small contact footprint and the pre...

Semiconductor package with small gate clip and assembly method

MCSP power semiconductor devices and preparation methods thereof

Top-exposed semiconductor package and the manufacturing method

Semiconductor package with small gate clip and assembly method

Ultra-small chip package and method for manufacturing the same

Patents Applicationslast 30 patents

POWER SEMICONDUCTOR DEVICE WITH SMALL CONTACT FOOTPRINT AND THE PRE...

SEMICONDUCTOR PACKAGE WITH SMALL GATE CLIP AND ASSEMBLY METHOD

SEMICONDUCTOR PACKAGE WITH SMALL GATE CLIP AND ASSEMBLY METHOD

MCSP POWER SEMICONDUCTOR DEVICES AND PREPARATION METHODS THEREOF

POWER SEMICONDUCTOR DEVICE WITH SMALL CONTACT FOOTPRINT AND THE PRE...

ULTRA-SMALL CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME