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Hongwon KIM

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Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor package
    • Patent number 11,676,915
    • Issue date Jun 13, 2023
    • Samsung Electronics Co., Ltd.
    • Taesung Jeong
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250046728
    • Publication date Feb 6, 2025
    • Samsung Electronics Co., Ltd.
    • Dongwon KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240387486
    • Publication date Nov 21, 2024
    • Samsung Electronics Co., Ltd.
    • Dahee Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240071895
    • Publication date Feb 29, 2024
    • Samsung Electronics Co., Ltd.
    • Seoeun KYUNG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220077078
    • Publication date Mar 10, 2022
    • Samsung Electronics Co., Ltd.
    • Taesung Jeong
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20210407962
    • Publication date Dec 30, 2021
    • Samsung Electronics Co., Ltd.
    • Hongwon KIM
    • H01 - BASIC ELECTRIC ELEMENTS