Hongying Zhang

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Merged power pad for improving integrated circuit power delivery
- Patent number 11,688,704
- Issue date Jun 27, 2023
- FutureWei Technologies, Inc.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Merged power pad for improving integrated circuit power delivery
- Patent number 11,233,025
- Issue date Jan 25, 2022
- FutureWei Technologies, Inc.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having reduced internal power pad pitch
- Patent number 10,672,730
- Issue date Jun 2, 2020
- FutureWei Technologies, Inc.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having reduced internal power pad pitch
- Patent number 10,304,792
- Issue date May 28, 2019
- FutureWei Technologies, Inc.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIPSET AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230130460
- Publication date Apr 27, 2023
- Shanghai Biren Technology Co.,Ltd
- Shiqun GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MERGED POWER PAD FOR IMPROVING INTEGRATED CIRCUIT POWER DELIVERY
- Publication number 20220148988
- Publication date May 12, 2022
- FutureWei Technologies, Inc.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING REDUCED INTERNAL POWER PAD PITCH
- Publication number 20190273060
- Publication date Sep 5, 2019
- FutureWei Technologies, Inc.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING REDUCED INTERNAL POWER PAD PITCH
- Publication number 20190148323
- Publication date May 16, 2019
- FutureWei Technologies, Inc.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MERGED POWER PAD FOR IMPROVING INTEGRATED CIRCUIT POWER DELIVERY
- Publication number 20180350762
- Publication date Dec 6, 2018
- FutureWei Technologies, Inc.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS