Hongyu Deng

Person

Saratoga, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Communication module packaging
- Patent number 10,952,312
- Issue date Mar 16, 2021
- II-VI DELAWARE, INC.
- Jianwei Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Horizontal flex circuit with resistance weldable cover
- Patent number 10,816,739
- Issue date Oct 27, 2020
- II-VI Delaware Inc.
- Frank Lei Ding
- G02 - OPTICS
Information Patent Grant
Chip on carrier
- Patent number 10,374,386
- Issue date Aug 6, 2019
- Finisar Corporation
- Jianwei Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic subassembly with components mounted on top and botto...
- Patent number 10,342,141
- Issue date Jul 2, 2019
- Finisar Corporation
- Maziar Amirkiai
- G02 - OPTICS
Information Patent Grant
Connector assemblies for optoelectronic modules
- Patent number 10,036,861
- Issue date Jul 31, 2018
- Finisar Corporation
- Frank Lei Ding
- G02 - OPTICS
Information Patent Grant
Optical transmitters
- Patent number 9,912,437
- Issue date Mar 6, 2018
- Finisar Corporation
- Tao Wu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Ferrule assemblies
- Patent number 9,874,704
- Issue date Jan 23, 2018
- Finisar Corporation
- Maziar Amirkiai
- G02 - OPTICS
Information Patent Grant
Multi-layer substrates including thin film signal lines
- Patent number 9,854,687
- Issue date Dec 26, 2017
- Finisar Corporation
- Maziar Amirkiai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optoelectronic subassembly with components mounted on top and botto...
- Patent number 9,848,498
- Issue date Dec 19, 2017
- Finisar Corporation
- Maziar Amirkiai
- G02 - OPTICS
Information Patent Grant
Lens receptacles
- Patent number 9,823,430
- Issue date Nov 21, 2017
- Finisar Corporation
- Maziar Amirkiai
- G02 - OPTICS
Information Patent Grant
Multi-lens optical components
- Patent number 9,804,349
- Issue date Oct 31, 2017
- Finisar Corporation
- Maziar Amirkiai
- G02 - OPTICS
Information Patent Grant
Hermetically sealing an optical subassembly
- Patent number 9,772,467
- Issue date Sep 26, 2017
- Finisar Corporation
- Maziar Amirkiai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wavelength division multiplexing
- Patent number 9,703,044
- Issue date Jul 11, 2017
- Finisar Corporation
- Xiaogang Hong
- G02 - OPTICS
Information Patent Grant
Transmission lines
- Patent number 9,686,856
- Issue date Jun 20, 2017
- Finisar Corporation
- Yunpeng Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-channel optoelectronic subassemblies
- Patent number 9,612,414
- Issue date Apr 4, 2017
- Finisar Corporation
- Maziar Amirkiai
- G02 - OPTICS
Information Patent Grant
3-D integrated package
- Patent number 9,437,912
- Issue date Sep 6, 2016
- Finisar Corporation
- Yunpeng Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resistive heating element for enabling laser operation
- Patent number 9,172,209
- Issue date Oct 27, 2015
- Finisar Corporation
- Hongyu Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3-D integrated package
- Patent number 9,013,891
- Issue date Apr 21, 2015
- Finisar Corporation
- Yunpeng Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transistor outline can with in-line electrical couplings
- Patent number 8,854,836
- Issue date Oct 7, 2014
- Finisar Corporation
- Hongyu Deng
- G02 - OPTICS
Information Patent Grant
Electronic module having multiple flex circuit connectors
- Patent number 8,721,193
- Issue date May 13, 2014
- Finisar Corporation
- Maziar Amirkiai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated laser and photodetector chip for an optical subassembly
- Patent number 8,463,132
- Issue date Jun 11, 2013
- Finisar Corporation
- Hongyu Deng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Low inductance optical transmitter submount assembly
- Patent number 8,447,153
- Issue date May 21, 2013
- Finisar Corporation
- Darin James Douma
- G02 - OPTICS
Information Patent Grant
Electro-absorption modulator integrated with a vertical cavity surf...
- Patent number 7,983,572
- Issue date Jul 19, 2011
- Finisar Corporation
- Hongyu Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Header assembly for communications module
- Patent number 7,972,068
- Issue date Jul 5, 2011
- Finisar Corporation
- Martin A. Kalberer
- G02 - OPTICS
Information Patent Grant
Optical interconnect solution
- Patent number 7,901,144
- Issue date Mar 8, 2011
- Finisar Corporation
- Hongyu Deng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Mini optical subassembly
- Patent number 7,901,145
- Issue date Mar 8, 2011
- Finisar Corporation
- Hongyu Deng
- G02 - OPTICS
Information Patent Grant
Optical micro-connector
- Patent number 7,806,602
- Issue date Oct 5, 2010
- Finisar Corporation
- Hongyu Deng
- G02 - OPTICS
Information Patent Grant
Directly modulated laser with integrated optical filter
- Patent number 7,778,552
- Issue date Aug 17, 2010
- Finisar Corporation
- Hongyu Deng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
VCSEL with integrated optical filter
- Patent number 7,738,795
- Issue date Jun 15, 2010
- Finisar Corporation
- Hongyu Deng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Single mode vertical cavity surface emitting laser using photonic c...
- Patent number 7,668,220
- Issue date Feb 23, 2010
- Finisar Corporation
- Jan Lipson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HORIZONTAL FLEX CIRCUIT WITH RESISTANCE WELDABLE COVER
- Publication number 20200116961
- Publication date Apr 16, 2020
- Finisar Corporation
- Frank Lei Ding
- G02 - OPTICS
Information Patent Application
CHIP ON CARRIER
- Publication number 20190379176
- Publication date Dec 12, 2019
- Finisar Corporation
- Jianwei Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMUNICATION MODULES
- Publication number 20190132941
- Publication date May 2, 2019
- Finisar Corporation
- Jianwei Mu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTOELECTRONIC SUBASSEMBLY WITH COMPONENTS MOUNTED ON TOP AND BOTTO...
- Publication number 20180116054
- Publication date Apr 26, 2018
- Finisar Corporation
- Maziar Amirkiai
- G02 - OPTICS
Information Patent Application
WAVELENGTH DIVISION MULTIPLEXING
- Publication number 20170082803
- Publication date Mar 23, 2017
- Finisar Corporation
- Xiaogang HONG
- G02 - OPTICS
Information Patent Application
OPTICAL TRANSMITTERS
- Publication number 20160277140
- Publication date Sep 22, 2016
- Finisar Corporation
- Tao Wu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
TEC INTEGRATED WITH SUBSTRATE
- Publication number 20160124167
- Publication date May 5, 2016
- Finisar Corporation
- Maziar Amirkiai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HERMETICALLY SEALING AN OPTICAL SUBASSEMBLY
- Publication number 20160077302
- Publication date Mar 17, 2016
- Finisar Corporation
- Maziar AMIRKIAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LENS RECEPTACLES
- Publication number 20160047996
- Publication date Feb 18, 2016
- Finisar Corporation
- Maziar Amirkiai
- G02 - OPTICS
Information Patent Application
MULTI-CHANNEL OPTOELECTRONIC SUBASSEMBLIES
- Publication number 20160047998
- Publication date Feb 18, 2016
- Finisar Corporation
- Maziar Amirkiai
- G02 - OPTICS
Information Patent Application
SUBSTRATES INCLUDING OPTOELECTRONIC COMPONENTS
- Publication number 20160050775
- Publication date Feb 18, 2016
- Finisar Corporation
- Maziar Amirkiai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FERRULE ASSEMBLIES
- Publication number 20160047992
- Publication date Feb 18, 2016
- Finisar Corporation
- Maziar Amirkiai
- G02 - OPTICS
Information Patent Application
MULTI-LENS OPTICAL COMPONENTS
- Publication number 20160047997
- Publication date Feb 18, 2016
- Finisar Corporation
- Maziar Amirkiai
- G02 - OPTICS
Information Patent Application
MULTI-LAYER SUBSTRATES
- Publication number 20160050751
- Publication date Feb 18, 2016
- Finisar Corporation
- Maziar Amirkiai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
3-D INTEGRATED PACKAGE
- Publication number 20160013536
- Publication date Jan 14, 2016
- Finisar Corporation
- Yunpeng SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMISSION LINES
- Publication number 20150288049
- Publication date Oct 8, 2015
- Finisar Corporation
- Yunpeng SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR OUTLINE CAN WITH IN-LINE ELECTRICAL COUPLINGS
- Publication number 20130279139
- Publication date Oct 24, 2013
- Hongyu Deng
- G02 - OPTICS
Information Patent Application
3-D INTEGRATED PACKAGE
- Publication number 20130235542
- Publication date Sep 12, 2013
- Finisar Corporation
- Yunpeng SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SUBASSEMBLY WITH AN EXTENDED RF PIN
- Publication number 20130163917
- Publication date Jun 27, 2013
- Finisar Corporation
- Maziar Amirkiai
- G02 - OPTICS
Information Patent Application
ELECTRONIC MODULE HAVING MULTIPLE FLEX CIRCUIT CONNECTORS
- Publication number 20120039572
- Publication date Feb 16, 2012
- Finisar Corporation
- Maziar Amirkiai
- G02 - OPTICS
Information Patent Application
HEADER ASSEMBLY FOR COMMUNICATIONS MODULE
- Publication number 20110013912
- Publication date Jan 20, 2011
- Martin A. Kalberer
- G02 - OPTICS
Information Patent Application
DIRECTLY MODULATED LASER WITH INTEGRATED OPTICAL FILTER
- Publication number 20100172650
- Publication date Jul 8, 2010
- Hongyu Deng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
DISTRIBUTED FEEDBACK LASER ARRAY
- Publication number 20090263074
- Publication date Oct 22, 2009
- Hongyu Deng
- G02 - OPTICS
Information Patent Application
Optical Micro-Connector
- Publication number 20090232511
- Publication date Sep 17, 2009
- Hongyu Deng
- G02 - OPTICS
Information Patent Application
Optical Interconnect Solution
- Publication number 20090232514
- Publication date Sep 17, 2009
- Hongyu Deng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Single Mode Vertical Cavity Surface Emitting Laser Using Photonic C...
- Publication number 20090232176
- Publication date Sep 17, 2009
- Jan Lipson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mini Optical Subassembly
- Publication number 20090232456
- Publication date Sep 17, 2009
- Hongyu Deng
- G02 - OPTICS
Information Patent Application
INTEGRATED LASER AND PHOTODETECTOR CHIP FOR AN OPTICAL SUBASSEMBLY
- Publication number 20090034982
- Publication date Feb 5, 2009
- Finisar Corporation
- Hongyu Deng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
FIBER OPTIC LINK HAVING AN INTEGRATED LASER AND PHOTODETECTOR CHIP
- Publication number 20090028579
- Publication date Jan 29, 2009
- Finisar Corporation
- Hongyu Deng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
RESISTIVE HEATING ELEMENT FOR ENABLING LASER OPERATION
- Publication number 20080267233
- Publication date Oct 30, 2008
- Finisar Corporation
- Hongyu Deng
- H01 - BASIC ELECTRIC ELEMENTS

Hongyu Deng

Person

Patents Grantslast 30 patents

Communication module packaging

Horizontal flex circuit with resistance weldable cover

Chip on carrier

Optoelectronic subassembly with components mounted on top and botto...

Connector assemblies for optoelectronic modules

Optical transmitters

Ferrule assemblies

Multi-layer substrates including thin film signal lines

Optoelectronic subassembly with components mounted on top and botto...

Lens receptacles

Multi-lens optical components

Hermetically sealing an optical subassembly

Wavelength division multiplexing

Transmission lines

Multi-channel optoelectronic subassemblies

3-D integrated package

Resistive heating element for enabling laser operation

3-D integrated package

Transistor outline can with in-line electrical couplings

Electronic module having multiple flex circuit connectors

Integrated laser and photodetector chip for an optical subassembly

Low inductance optical transmitter submount assembly

Electro-absorption modulator integrated with a vertical cavity surf...

Header assembly for communications module

Optical interconnect solution

Mini optical subassembly

Optical micro-connector

Directly modulated laser with integrated optical filter

VCSEL with integrated optical filter

Single mode vertical cavity surface emitting laser using photonic c...

Patents Applicationslast 30 patents

HORIZONTAL FLEX CIRCUIT WITH RESISTANCE WELDABLE COVER

CHIP ON CARRIER

COMMUNICATION MODULES

OPTOELECTRONIC SUBASSEMBLY WITH COMPONENTS MOUNTED ON TOP AND BOTTO...

WAVELENGTH DIVISION MULTIPLEXING

OPTICAL TRANSMITTERS

TEC INTEGRATED WITH SUBSTRATE

HERMETICALLY SEALING AN OPTICAL SUBASSEMBLY

LENS RECEPTACLES

MULTI-CHANNEL OPTOELECTRONIC SUBASSEMBLIES

SUBSTRATES INCLUDING OPTOELECTRONIC COMPONENTS

FERRULE ASSEMBLIES

MULTI-LENS OPTICAL COMPONENTS

MULTI-LAYER SUBSTRATES

3-D INTEGRATED PACKAGE

TRANSMISSION LINES

TRANSISTOR OUTLINE CAN WITH IN-LINE ELECTRICAL COUPLINGS

3-D INTEGRATED PACKAGE

OPTICAL SUBASSEMBLY WITH AN EXTENDED RF PIN

ELECTRONIC MODULE HAVING MULTIPLE FLEX CIRCUIT CONNECTORS

HEADER ASSEMBLY FOR COMMUNICATIONS MODULE

DIRECTLY MODULATED LASER WITH INTEGRATED OPTICAL FILTER

DISTRIBUTED FEEDBACK LASER ARRAY

Optical Micro-Connector

Optical Interconnect Solution

Single Mode Vertical Cavity Surface Emitting Laser Using Photonic C...

Mini Optical Subassembly

INTEGRATED LASER AND PHOTODETECTOR CHIP FOR AN OPTICAL SUBASSEMBLY

FIBER OPTIC LINK HAVING AN INTEGRATED LASER AND PHOTODETECTOR CHIP

RESISTIVE HEATING ELEMENT FOR ENABLING LASER OPERATION