Honny Chen

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package having thermally conductive layers for...
- Patent number 11,488,883
- Issue date Nov 1, 2022
- Western Digital Technologies, Inc.
- Yazhou Zhang
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device including stacked die with continuous integral...
- Patent number 10,304,816
- Issue date May 28, 2019
- Western Digital Technologies, Inc.
- Shiv Kumar
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING THERMALLY CONDUCTIVE LAYERS FOR...
- Publication number 20220328374
- Publication date Oct 13, 2022
- Western Digital Technologies, Inc.
- Yazhou Zhang
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20170309608
- Publication date Oct 26, 2017
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Shiv Kumar
- H01 - BASIC ELECTRIC ELEMENTS