Hoon Jung

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Icheon-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packaging system with heatsink cap and method of...
- Patent number 9,142,481
- Issue date Sep 22, 2015
- Stats Chippac Ltd.
- Gwangjin Kim
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEATSINK CAP AND METHOD OF...
- Publication number 20130322023
- Publication date Dec 5, 2013
- Gwangjin Kim
- H01 - BASIC ELECTRIC ELEMENTS