HOONSEOK SEO

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Niskayuna, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with fine metal lines for BEOL structure and m...
- Patent number 12,243,820
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Taeyong Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices including a power rail and methods of fo...
- Patent number 12,230,571
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Gilhwan Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an integrated circuit device having an etch-stop...
- Patent number 12,218,054
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Taeyong Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside power distribution network semiconductor package and metho...
- Patent number 12,142,564
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon buried power rail implemented backside power distri...
- Patent number 12,125,788
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-damascene structure with dielectric hardmask layer
- Patent number 12,014,951
- Issue date Jun 18, 2024
- Samsung Electronics Co., Ltd.
- Hoonseok Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with fine metal lines for BEOL structure and m...
- Patent number 11,990,409
- Issue date May 21, 2024
- Samsung Electronics Co., Ltd.
- Taeyong Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon buried power rail implemented backside power distri...
- Patent number 11,881,455
- Issue date Jan 23, 2024
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside power distribution network semiconductor package and metho...
- Patent number 11,769,728
- Issue date Sep 26, 2023
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned supervia and metal direct etching process to manufactu...
- Patent number 11,488,864
- Issue date Nov 1, 2022
- Samsung Electronics Co., Ltd.
- Taeyong Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices including metal wires having etch stop l...
- Patent number 11,450,608
- Issue date Sep 20, 2022
- Samsung Electronics Co., Ltd.
- Taeyong Bae
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMAL BUDGET ENHANCED BURIED POWER RAIL AND METHOD OF MANUFACTURI...
- Publication number 20240429169
- Publication date Dec 26, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- Saehan PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMI-DAMASCENE STRUCTURE WITH DIELECTRIC HARDMASK LAYER
- Publication number 20240297072
- Publication date Sep 5, 2024
- Samsung Electronics Co., Ltd.
- Hoonseok Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FINE METAL LINES FOR BEOL STRUCTURE AND M...
- Publication number 20240213155
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- TAEYONG BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON BURIED POWER RAIL IMPLEMENTED BACKSIDE POWER DISTRI...
- Publication number 20240063123
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER DISTRIBUTION NETWORK SEMICONDUCTOR PACKAGE AND METHO...
- Publication number 20230411294
- Publication date Dec 21, 2023
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING A POWER RAIL AND METHODS OF FO...
- Publication number 20230163073
- Publication date May 25, 2023
- Samsung Electronics Co., Ltd.
- GILHWAN SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING A METAL RESISTOR AND METHODS O...
- Publication number 20230095421
- Publication date Mar 30, 2023
- Samsung Electronics Co., Ltd.
- Byounghak Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON BURIED POWER RAIL IMPLEMENTED BACKSIDE POWER DISTRI...
- Publication number 20220384345
- Publication date Dec 1, 2022
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMI-DAMASCENE STRUCTURE WITH DIELECTRIC HARDMASK LAYER
- Publication number 20220375785
- Publication date Nov 24, 2022
- Samsung Electronics Co., Ltd.
- Hoonseok Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL BUDGET ENHANCED BURIED POWER RAIL AND METHOD OF MANUFACTURI...
- Publication number 20220336355
- Publication date Oct 20, 2022
- Samsung Electronics Co., Ltd.
- Saehan PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FINE METAL LINES FOR BEOL STRUCTURE AND M...
- Publication number 20220336352
- Publication date Oct 20, 2022
- Samsung Electronics Co., Ltd.
- TAEYONG BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING METAL WIRES AND METHODS OF FOR...
- Publication number 20220336353
- Publication date Oct 20, 2022
- Samsung Electronics Co., Ltd.
- TAEYONG BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER DISTRIBUTION NETWORK SEMICONDUCTOR PACKAGE AND METHO...
- Publication number 20220157723
- Publication date May 19, 2022
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED SUPERVIA AND METAL DIRECT ETCHING PROCESS TO MANUFACTU...
- Publication number 20220108921
- Publication date Apr 7, 2022
- Samsung Electronics Co., Ltd.
- Taeyong BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING METAL WIRES AND METHODS OF FOR...
- Publication number 20220045003
- Publication date Feb 10, 2022
- Samsung Electronics Co., Ltd.
- TAEYONG BAE
- H01 - BASIC ELECTRIC ELEMENTS

HOONSEOK SEO

Person

Patents Grantslast 30 patents

Semiconductor device with fine metal lines for BEOL structure and m...

Integrated circuit devices including a power rail and methods of fo...

Method of forming an integrated circuit device having an etch-stop...

Backside power distribution network semiconductor package and metho...

Through silicon buried power rail implemented backside power distri...

Semi-damascene structure with dielectric hardmask layer

Semiconductor device with fine metal lines for BEOL structure and m...

Through silicon buried power rail implemented backside power distri...

Backside power distribution network semiconductor package and metho...

Self-aligned supervia and metal direct etching process to manufactu...

Integrated circuit devices including metal wires having etch stop l...

Patents Applicationslast 30 patents

THERMAL BUDGET ENHANCED BURIED POWER RAIL AND METHOD OF MANUFACTURI...

SEMI-DAMASCENE STRUCTURE WITH DIELECTRIC HARDMASK LAYER

SEMICONDUCTOR DEVICE WITH FINE METAL LINES FOR BEOL STRUCTURE AND M...

THROUGH SILICON BURIED POWER RAIL IMPLEMENTED BACKSIDE POWER DISTRI...

BACKSIDE POWER DISTRIBUTION NETWORK SEMICONDUCTOR PACKAGE AND METHO...

INTEGRATED CIRCUIT DEVICES INCLUDING A POWER RAIL AND METHODS OF FO...

INTEGRATED CIRCUIT DEVICES INCLUDING A METAL RESISTOR AND METHODS O...

THROUGH SILICON BURIED POWER RAIL IMPLEMENTED BACKSIDE POWER DISTRI...

SEMI-DAMASCENE STRUCTURE WITH DIELECTRIC HARDMASK LAYER

THERMAL BUDGET ENHANCED BURIED POWER RAIL AND METHOD OF MANUFACTURI...

SEMICONDUCTOR DEVICE WITH FINE METAL LINES FOR BEOL STRUCTURE AND M...

INTEGRATED CIRCUIT DEVICES INCLUDING METAL WIRES AND METHODS OF FOR...

BACKSIDE POWER DISTRIBUTION NETWORK SEMICONDUCTOR PACKAGE AND METHO...

SELF-ALIGNED SUPERVIA AND METAL DIRECT ETCHING PROCESS TO MANUFACTU...

INTEGRATED CIRCUIT DEVICES INCLUDING METAL WIRES AND METHODS OF FOR...