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Hope Chiu
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Shanghai, CN
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device package mold flow control system and method
Patent number
12,062,625
Issue date
Aug 13, 2024
SanDisk Technologies, Inc.
Hope Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with unbalanced die stackup
Patent number
12,027,497
Issue date
Jul 2, 2024
Western Digital Technologies, Inc.
Haiyue Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reducing keep-out-zone area for a semiconductor device
Patent number
12,021,060
Issue date
Jun 25, 2024
Western Digital Technologies, Inc.
Kevin Du
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged memory device with flip chip and wire bond dies
Patent number
12,021,061
Issue date
Jun 25, 2024
Western Digital Technologies, Inc.
Rui Yuan
G11 - INFORMATION STORAGE
Information
Patent Grant
Semiconductor device package with exposed bond wires
Patent number
11,942,459
Issue date
Mar 26, 2024
Western Digital Technologies, Inc.
Hua Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip-chip package with reduced underfill area
Patent number
11,837,476
Issue date
Dec 5, 2023
Western Digital Technologies, Inc.
Yazhou Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate component layout and bonding method for increased package...
Patent number
11,810,896
Issue date
Nov 7, 2023
Western Digital Technologies, Inc.
Jiandi Du
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package having thermally conductive pathways
Patent number
11,508,644
Issue date
Nov 22, 2022
Western Digital Technologies, Inc.
Yazhou Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package having thermally conductive layers for...
Patent number
11,488,883
Issue date
Nov 1, 2022
Western Digital Technologies, Inc.
Yazhou Zhang
G11 - INFORMATION STORAGE
Patents Applications
last 30 patents
Information
Patent Application
BIFACIAL SEMICONDUCTOR WAFER
Publication number
20240063092
Publication date
Feb 22, 2024
Western Digital Technologies, Inc.
Sara Shi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Laser Cutting With Electron Removal
Publication number
20230411179
Publication date
Dec 21, 2023
Western Digital Technologies, Inc.
Cong ZHANG
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor Device With Optimized Underfill Flow
Publication number
20230299034
Publication date
Sep 21, 2023
Western Digital Technologies, Inc.
Yihao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device Package with Exposed Bond Wires
Publication number
20230260975
Publication date
Aug 17, 2023
Western Digital Technologies, Inc.
Hua Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device With Unbalanced Die Stackup
Publication number
20230246000
Publication date
Aug 3, 2023
Western Digital Technologies, Inc.
Haiyue Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device Package Having Improved Conductive Stub Coverage
Publication number
20230129628
Publication date
Apr 27, 2023
Western Digital Technologies, Inc.
Simon Dong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device Package Mold Flow Control System and Method
Publication number
20230102959
Publication date
Mar 30, 2023
Western Digital Technologies, Inc.
Hope Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device Package Die Stacking System and Method
Publication number
20230011439
Publication date
Jan 12, 2023
Western Digital Technologies, Inc.
Yazhou Zhang
G11 - INFORMATION STORAGE
Information
Patent Application
Substrate Component Layout and Bonding Method for Increased Package...
Publication number
20220375896
Publication date
Nov 24, 2022
Western Digital Technologies, Inc.
Jiandi DU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING THERMALLY CONDUCTIVE LAYERS FOR...
Publication number
20220328374
Publication date
Oct 13, 2022
Western Digital Technologies, Inc.
Yazhou Zhang
G11 - INFORMATION STORAGE
Information
Patent Application
PACKAGED MEMORY DEVICE WITH FLIP CHIP AND WIRE BOND DIES
Publication number
20220285316
Publication date
Sep 8, 2022
Western Digital Technologies, Inc.
Rui Yuan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING THERMALLY CONDUCTIVE PATHWAYS
Publication number
20220216128
Publication date
Jul 7, 2022
Western Digital Technologies, Inc.
Yazhou Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REDUCING KEEP-OUT-ZONE AREA FOR A SEMICONDUCTOR DEVICE
Publication number
20220093559
Publication date
Mar 24, 2022
Western Digital Technologies, Inc.
Kevin Du
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP-CHIP PACKAGE WITH REDUCED UNDERFILL AREA
Publication number
20210335628
Publication date
Oct 28, 2021
Western Digital Technologies, Inc.
Yazhou Zhang
H01 - BASIC ELECTRIC ELEMENTS