Horst Brüggmann

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Berlin, DE

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Patents Grantslast 30 patents

Information Patent Grant
Method of preparing a high density interconnect printed circuit boa...
- Patent number 12,245,383
- Issue date Mar 4, 2025
- Atotech Deutschland GmbH & Co. KG
- Bert Reents
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Manufacturing sequences for high density interconnect printed circu...
- Patent number 12,063,751
- Issue date Aug 13, 2024
- Atotech Deutschland GmbH & Co. KG
- Akif Özkök
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for electroplating a metal onto a substrate
- Patent number 11,015,257
- Issue date May 25, 2021
- Atotech Deutschland GmbH
- Toshia Fujiwara
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for electroplating a metal onto a substrate
- Patent number 10,501,860
- Issue date Dec 10, 2019
- Atotech Deutschland GmbH
- Toshia Fujiwara
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...
- Publication number 20240341042
- Publication date Oct 10, 2024
- Atotech Deutschland GmbH & Co. KG
- Bert REENTS
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MANUFACTURING SEQUENCES FOR HIGH DENSITY INTERCONNECT PRINTED CIRCU...
- Publication number 20220304164
- Publication date Sep 22, 2022
- Atotech Deutschland GmbH & Co. KG
- Akif ÖZKÖK
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...
- Publication number 20220279662
- Publication date Sep 1, 2022
- Atotech Deutschland GmbH & Co. KG
- Bert REENTS
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR ELECTROPLATING A METAL ONTO A SUBSTRATE
- Publication number 20200080217
- Publication date Mar 12, 2020
- Atotech Deutschland GmbH
- Toshia Fujiwara
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR ELECTROPLATING A METAL ONTO A SUBSTRATE
- Publication number 20180010258
- Publication date Jan 11, 2018
- Atotech Deutschland GmbH
- Toshia Fujiwara
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR