Horst Uwe Faulhaber

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Patents Grantslast 30 patents

Information Patent Grant
Package comprising a substrate that includes a stress buffer layer
- Patent number 11,088,090
- Issue date Aug 10, 2021
- QUALCOMM Incorporated
- Sebastian Brunner
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE COMPRISING AN ACOUSTIC DEVICE AND A CAP SUBSTRATE COMPRISIN...
- Publication number 20230101228
- Publication date Mar 30, 2023
- RF360 EUROPE GMBH
- Sebastian BRUNNER
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE THAT INCLUDES A STRESS BUFFER LAYER
- Publication number 20210249361
- Publication date Aug 12, 2021
- QUALCOMM Incorporated
- Sebastian BRUNNER
- H01 - BASIC ELECTRIC ELEMENTS