Hotae Jin

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Cheonan-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Wafer dividing apparatus and methods
- Patent number 8,506,832
- Issue date Aug 13, 2013
- Samsung Electronics Co., Ltd.
- Hotae Jin
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
Wafer dividing apparatus and methods
- Publication number 20110053376
- Publication date Mar 3, 2011
- Samsung Electronics Co., Ltd.
- Hotae Jin
- B28 - WORKING CEMENT, CLAY, OR STONE