TREA

Hou-Chang Kuo

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  • Kaohsiung, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    Thin flip chip package structure
    • Patent number 8,497,571
    • Issue date Jul 30, 2013
    • Chipbond Technology Corporation
    • Chin-Tang Hsieh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Thin flip chip package structure
    • Patent number 8,471,372
    • Issue date Jun 25, 2013
    • Chipbound Technology Corporation
    • Chin-Tang Hsieh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Heat-spread substrate
    • Patent number 6,483,187
    • Issue date Nov 19, 2002
    • Advanced Semiconductor Engineering, Inc.
    • Shin-Hua Chao
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents