Hou Tee Ng

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Method to encapsulate copper plug for interconnect metallization
- Patent number 6,696,761
- Issue date Feb 24, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Lap Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Highly selective and complete interconnect metal line and via/conta...
- Patent number 6,660,636
- Issue date Dec 9, 2003
- The National University of Singapore
- Sam Fong Yau Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to deposit a seeding layer for electroless copper plating
- Patent number 6,495,200
- Issue date Dec 17, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Lap Chan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method to form uniform silicide features
- Patent number 6,281,117
- Issue date Aug 28, 2001
- Chartered Semiconductor Manufacturing Ltd.
- Lap Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to encapsulate copper plug for interconnect metallization
- Patent number 6,214,728
- Issue date Apr 10, 2001
- Chartered Semiconductor Manufacturing, Ltd.
- Lap Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High precision three-dimensional alignment system for lithography,...
- Patent number 6,181,097
- Issue date Jan 30, 2001
- Institute of Materials Research and Engineering
- Sam Fong Yau Li
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method for planarized interconnect vias using electroless plating a...
- Patent number 6,136,693
- Issue date Oct 24, 2000
- Chartered Semiconductor Manufacturing Ltd.
- Lap Chan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD TO ENCAPSULATE COPPER PLUG FOR INTERCONNECT METALLIZATION
- Publication number 20040009664
- Publication date Jan 15, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Lap Chan
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Method to encapsulate copper plug for interconnect metallization

Highly selective and complete interconnect metal line and via/conta...

Method to deposit a seeding layer for electroless copper plating

Method to form uniform silicide features

Method to encapsulate copper plug for interconnect metallization

High precision three-dimensional alignment system for lithography,...

Method for planarized interconnect vias using electroless plating a...

Patents Applicationslast 30 patents

METHOD TO ENCAPSULATE COPPER PLUG FOR INTERCONNECT METALLIZATION