Houde Zhou

Person

Wuhan, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structure and packaging method thereof
- Patent number 12,205,940
- Issue date Jan 21, 2025
- Yangtze Memory Technologies Co., Ltd.
- Peng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip stacking structures and methods for forming the same
- Patent number 12,166,012
- Issue date Dec 10, 2024
- Yangtze Memory Technologies Co., Ltd.
- Xinru Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing semiconductor wafers
- Patent number 12,131,924
- Issue date Oct 29, 2024
- Yangtze Memory Technologies Co., Ltd.
- Liquan Cai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 12,125,827
- Issue date Oct 22, 2024
- Yangtze Memory Technologies Co., Ltd.
- XinRu Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser system for dicing semiconductor structure and operation metho...
- Patent number 12,121,995
- Issue date Oct 22, 2024
- Yangtze Memory Technologies Co., Ltd.
- Liquan Cai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser dicing system and method for dicing semiconductor structure i...
- Patent number 12,106,985
- Issue date Oct 1, 2024
- Yangtze Memory Technologies Co., Ltd.
- Liquan Cai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package structure and packaging method thereof
- Patent number 11,721,686
- Issue date Aug 8, 2023
- Yangtze Memory Technologies Co., Ltd.
- Peng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure, and fabrication and packaging methods thereof
- Patent number 11,694,904
- Issue date Jul 4, 2023
- Yangtze Memory Technologies Co., Ltd.
- XinRu Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 11,688,721
- Issue date Jun 27, 2023
- Yangtze Memory Technologies Co., Ltd.
- XinRu Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of integrated circuit packaging structure
- Patent number 11,476,173
- Issue date Oct 18, 2022
- Yangtze Memory Technologies Co., Ltd.
- Peng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component comprising substrate with thermal indicator
- Patent number 11,469,153
- Issue date Oct 11, 2022
- Yangtze Memory Technologies Co., Ltd.
- Peng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with stacked chips and manufacturing method...
- Patent number 11,133,290
- Issue date Sep 28, 2021
- Yangtze Memory Technologies Co., Ltd.
- XinRu Zeng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF
- Publication number 20250096220
- Publication date Mar 20, 2025
- Yangtze Memory Technologies Co., Ltd.
- Peng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20250022850
- Publication date Jan 16, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xinru ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20250022851
- Publication date Jan 16, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xinru ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER SYSTEM FOR DICING SEMICONDUCTOR STRUCTURE AND OPERATION METHO...
- Publication number 20250010403
- Publication date Jan 9, 2025
- Yangtze Memory Technologies Co., Ltd.
- Liquan Cai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER SYSTEM FOR DICING SEMICONDUCTOR STRUCTURE AND OPERATION METHO...
- Publication number 20250010402
- Publication date Jan 9, 2025
- Yangtze Memory Technologies Co., Ltd.
- Liquan Cai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF
- Publication number 20230343773
- Publication date Oct 26, 2023
- Yangtze Memory Technologies Co., Ltd.
- Peng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230275070
- Publication date Aug 31, 2023
- Yangtze Memory Technologies Co., Ltd.
- XinRu Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE, AND FABRICATION AND PACKAGING METHODS THEREOF
- Publication number 20230268197
- Publication date Aug 24, 2023
- Yangtze Memory Technologies Co., Ltd.
- XinRu Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY SYSTEM PACKAGING STRUCTURE, AND METHOD FOR FORMING THE SAME
- Publication number 20230209842
- Publication date Jun 29, 2023
- Yangtze Memory Technologies Co., Ltd.
- XinRu Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC INTERFERENCE SHIELDING PACKAGE STRUCTURES AND FABRI...
- Publication number 20220392849
- Publication date Dec 8, 2022
- Yangtze Memory Technologies Co., Ltd.
- Peng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DICING SYSTEM AND METHOD FOR DICING SEMICONDUCTOR STRUCTURE
- Publication number 20220319888
- Publication date Oct 6, 2022
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Liquan CAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER SYSTEM FOR DICING SEMICONDUCTOR STRUCTURE AND OPERATION METHO...
- Publication number 20220314369
- Publication date Oct 6, 2022
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Liquan Cai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF
- Publication number 20220278089
- Publication date Sep 1, 2022
- Yangtze Memory Technologies Co., Ltd.
- Peng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20220254755
- Publication date Aug 11, 2022
- Yangtze Memory Technologies Co., Ltd.
- Xinru ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE, AND FABRICATION AND PACKAGING METHODS THEREOF
- Publication number 20220238351
- Publication date Jul 28, 2022
- Yangtze Memory Technologies Co., Ltd.
- XinRu Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING SEMICONDUCTOR WAFERS
- Publication number 20220157627
- Publication date May 19, 2022
- Yangtze Memory Technologies Co., Ltd.
- Liquan CAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
IC PACKAGE
- Publication number 20220013471
- Publication date Jan 13, 2022
- Yangtze Memory Technologies Co., Ltd.
- Houde Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210384166
- Publication date Dec 9, 2021
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- XinRu Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210167039
- Publication date Jun 3, 2021
- Yangtze Memory Technologies Co., Ltd.
- XinRu Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT COMPRISING SUBSTRATE WITH THERMAL INDICATOR
- Publication number 20210082838
- Publication date Mar 18, 2021
- Yangtze Memory Technologies Co., Ltd.
- Peng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF INTEGRATED CIRCUIT PACKAGING STRUCTURE
- Publication number 20200335410
- Publication date Oct 22, 2020
- Yangtze Memory Technologies Co., Ltd.
- Peng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING STRUCTURE AND MANUFACTURING METHOD THE...
- Publication number 20200235023
- Publication date Jul 23, 2020
- Yangtze Memory Technologies Co., Ltd.
- Peng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE
- Publication number 20200135656
- Publication date Apr 30, 2020
- Yangtze Memory Technologies Co., Ltd.
- Houde Zhou
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor package structure and packaging method thereof

Flip-chip stacking structures and methods for forming the same

Method for processing semiconductor wafers

Chip package structure and manufacturing method thereof

Laser system for dicing semiconductor structure and operation metho...

Laser dicing system and method for dicing semiconductor structure i...

Semiconductor package structure and packaging method thereof

Substrate structure, and fabrication and packaging methods thereof

Chip package structure and manufacturing method thereof

Manufacturing method of integrated circuit packaging structure

Electronic component comprising substrate with thermal indicator

Chip package structure with stacked chips and manufacturing method...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF

FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME

FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME

LASER SYSTEM FOR DICING SEMICONDUCTOR STRUCTURE AND OPERATION METHO...

LASER SYSTEM FOR DICING SEMICONDUCTOR STRUCTURE AND OPERATION METHO...

SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SUBSTRATE STRUCTURE, AND FABRICATION AND PACKAGING METHODS THEREOF

MEMORY SYSTEM PACKAGING STRUCTURE, AND METHOD FOR FORMING THE SAME

ELECTROMAGNETIC INTERFERENCE SHIELDING PACKAGE STRUCTURES AND FABRI...

LASER DICING SYSTEM AND METHOD FOR DICING SEMICONDUCTOR STRUCTURE

LASER SYSTEM FOR DICING SEMICONDUCTOR STRUCTURE AND OPERATION METHO...

SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF

FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME

SUBSTRATE STRUCTURE, AND FABRICATION AND PACKAGING METHODS THEREOF

METHOD FOR PROCESSING SEMICONDUCTOR WAFERS

IC PACKAGE

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

ELECTRONIC COMPONENT COMPRISING SUBSTRATE WITH THERMAL INDICATOR

MANUFACTURING METHOD OF INTEGRATED CIRCUIT PACKAGING STRUCTURE

INTEGRATED CIRCUIT PACKAGING STRUCTURE AND MANUFACTURING METHOD THE...

IC PACKAGE