Houssain Jomas

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Phoenix, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Mechanical adhesion of copper metallization to dielectric with part...
- Patent number 8,425,785
- Issue date Apr 23, 2013
- Intel Corporation
- Ravi Nalla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MECHANICAL ADHESION OF COPPER METALLIZATION TO DIELECTRIC WITH PART...
- Publication number 20090242109
- Publication date Oct 1, 2009
- Ravi Nalla
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...