How Kiat Liew

Person

Ipoh, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Thin semiconductor package for notched semiconductor die
- Patent number 11,942,369
- Issue date Mar 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package and related methods
- Patent number 11,791,297
- Issue date Oct 17, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Sw Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package and related methods
- Patent number 11,244,918
- Issue date Feb 8, 2022
- Semiconductor Components Industries, LLC
- Sw Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat no leads package with locking feature
- Patent number 10,825,754
- Issue date Nov 3, 2020
- Semiconductor Components Industries, LLC
- Soon Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin semiconductor package and related methods
- Patent number 10,763,173
- Issue date Sep 1, 2020
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin semiconductor package and related methods
- Patent number 10,319,639
- Issue date Jun 11, 2019
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die support for enlarging die size
- Patent number 9,748,163
- Issue date Aug 29, 2017
- Semiconductor Components Industries, LLC
- Soon Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale packages and related methods
- Patent number 9,281,258
- Issue date Mar 8, 2016
- Semiconductor Components Industries, LLC
- Bih Wen Fon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDED SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20240006363
- Publication date Jan 4, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Sw WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20220157756
- Publication date May 19, 2022
- Semiconductor Components Industries, LLC
- Sw WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUAD FLAT NO LEADS PACKAGE WITH LOCKING FEATURE
- Publication number 20210043550
- Publication date Feb 11, 2021
- Semiconductor Components Industries, LLC
- Soon Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20200357697
- Publication date Nov 12, 2020
- Semiconductor Components Industries, LLC
- Shutesh KRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-LEAD SEMICONDUCTOR DEVICE PACKAGES WITH ELECTRICALLY ISOLAT...
- Publication number 20200035586
- Publication date Jan 30, 2020
- Semiconductor Components Industries, LLC
- Jin Yoong LIONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20190252255
- Publication date Aug 15, 2019
- Semiconductor Components Industries, LLC
- Shutesh KRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20190057947
- Publication date Feb 21, 2019
- Semiconductor Components Industries, LLC
- Sw WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20190057900
- Publication date Feb 21, 2019
- Semiconductor Components Industries, LLC
- Shutesh KRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUAD FLAT NO LEADS PACKAGE
- Publication number 20180040539
- Publication date Feb 8, 2018
- Semiconductor Components Industries, LLC
- Soon Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES AND RELATED METHODS
- Publication number 20170162742
- Publication date Jun 8, 2017
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES AND RELATED METHODS
- Publication number 20160111581
- Publication date Apr 21, 2016
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS

How Kiat Liew

Person

Patents Grantslast 30 patents

Thin semiconductor package for notched semiconductor die

Molded semiconductor package and related methods

Molded semiconductor package and related methods

Quad flat no leads package with locking feature

Thin semiconductor package and related methods

Thin semiconductor package and related methods

Die support for enlarging die size

Chip scale packages and related methods

Patents Applicationslast 30 patents

MOLDED SEMICONDUCTOR PACKAGE AND RELATED METHODS

MOLDED SEMICONDUCTOR PACKAGE AND RELATED METHODS

QUAD FLAT NO LEADS PACKAGE WITH LOCKING FEATURE

THIN SEMICONDUCTOR PACKAGE AND RELATED METHODS

CHIP-ON-LEAD SEMICONDUCTOR DEVICE PACKAGES WITH ELECTRICALLY ISOLAT...

THIN SEMICONDUCTOR PACKAGE AND RELATED METHODS

MOLDED SEMICONDUCTOR PACKAGE AND RELATED METHODS

THIN SEMICONDUCTOR PACKAGE AND RELATED METHODS

QUAD FLAT NO LEADS PACKAGE

PACKAGED SEMICONDUCTOR DEVICES AND RELATED METHODS

PACKAGED SEMICONDUCTOR DEVICES AND RELATED METHODS