Howard Allen

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Limington, ME, US

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Patents Grantslast 30 patents

Information Patent Grant
Microelectromechanical systems microphone packaging systems
- Patent number 8,421,168
- Issue date Apr 16, 2013
- Fairchild Semiconductor Corporation
- Howard Allen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacking quad pre-molded component packages, systems using the same...
- Patent number 7,829,988
- Issue date Nov 9, 2010
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked dual-die packages, methods of making, and systems incorpora...
- Patent number 7,768,123
- Issue date Aug 3, 2010
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging system for die-up connection of a die-down oriented integ...
- Patent number 6,891,257
- Issue date May 10, 2005
- Fairchild Semiconductor Corporation
- David Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach method and integrated circuit device
- Patent number 5,904,504
- Issue date May 18, 1999
- Fairchild Semiconductor Corp.
- Howard Allen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTROMECHANICAL SYSTEMS MICROPHONE PACKAGING SYSTEMS
- Publication number 20110121413
- Publication date May 26, 2011
- Howard Allen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKABLE SEMICONDUCTOR PACKAGE AND PROCESS TO MANUFACTURE SAME
- Publication number 20100148337
- Publication date Jun 17, 2010
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacking Quad Pre-Molded Component Packages, Systems Using the Same...
- Publication number 20100072590
- Publication date Mar 25, 2010
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Dual-Die Packages, Methods of Making, and Systems Incorpora...
- Publication number 20090079092
- Publication date Mar 26, 2009
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging system for die-up connection of a die-down oriented integ...
- Publication number 20040080056
- Publication date Apr 29, 2004
- David Chong Sook Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging system for die-up connection of a die-down oriented integ...
- Publication number 20020140070
- Publication date Oct 3, 2002
- Fairchild Semiconductor Corp.
- David Chong Sook Lim
- H01 - BASIC ELECTRIC ELEMENTS